scholarly journals Sensitivity Analysis of a Portable Wireless PCB-MEMS Permittivity Sensor Node for Non-Invasive Liquid Recognition

Micromachines ◽  
2021 ◽  
Vol 12 (9) ◽  
pp. 1068
Author(s):  
Javier Meléndez-Campos ◽  
Matias Vázquez-Piñón ◽  
Sergio Camacho-Leon

Dielectric characteristics are useful to determine crucial properties of liquids and to differentiate between liquid samples with similar physical characteristics. Liquid recognition has found applications in a broad variety of fields, including healthcare, food science, and quality inspection, among others. This work demonstrates the fabrication, instrumentation, and functionality of a portable wireless sensor node for the permittivity measurement of liquids that require characterization and differentiation. The node incorporates an interdigitated microelectrode array as a transducer and a microcontroller unit with radio communication electronics for data processing and transmission, which enable a wide variety of stand-alone applications. A laser-ablation-based microfabrication technique is applied to fabricate the microelectromechanical systems (MEMS) transducer on a printed circuit board (PCB) substrate. The surface of the transducer is covered with a thin layer of SU-8 polymer by spin coating, which prevents it from direct contact with the Cu electrodes and the liquid sample. This helps to enhance durability, avoid electrode corrosion and contamination of the liquid sample, and to prevent undesirable electrochemical reactions to arise. The transducer’s impedance was modeled as a Randles cell, having resistive and reactive components determined analytically using a square wave as stimuli, and a resistor as a current-to-voltage converter. To characterize the node sensitivity under different conditions, three different transducer designs were fabricated and tested for four different fluids, i.e., air, isopropanol, glycerin, and distilled water—achieving a sensitivity of 1.6965 +/− 0.2028 εr/pF. The use of laser ablation allowed the reduction of the transducer footprint while maintaining its sensitivity within an adequate value for the targeted applications.

2021 ◽  
Vol 4 (1) ◽  
pp. 40
Author(s):  
Javier Meléndez-Campos ◽  
Matias Vázquez-Piñón ◽  
Sergio Camacho-Leon

Dielectric characteristics are useful to determine crucial properties of liquids and to differentiate between liquid samples with similar physical characteristics. Liquid recognition has found applications in a broad variety of fields, including healthcare, food science, and quality inspection, among others. This work demonstrates the fabrication, instrumentation, and functionality of a portable wireless sensor node for permittivity measurement of liquids that require characterization and differentiation. The node incorporates an interdigitated microelectrode array as transducer, and a microcontroller unit with radio communication electronics for data processing and transmission, which enables a wide variety of stand-alone applications. A laser-ablation-based microfabrication technique is applied to fabricate the microelectromechanical systems (MEMS) transducer on a printed circuit board (PCB) substrate. The surface of the transducer is covered with a thin layer of SU-8 polymer by spin coating, which prevents direct contact between the Cu electrodes and the liquid sample. This helps to enhance durability, avoid electrode corrosion and contamination of the liquid sample, and to prevent undesirable electrochemical reactions from arising. The transducer’s impedance was modelled as a Randles cell, having resistive and reactive components determined analytically, using a square wave as stimuli and a resistor as a current-to-voltage converter. To characterize the node sensitivity under different conditions, three different transducer designs were fabricated and tested for four different fluids—i.e., air, isopropanol, glycerin, and distilled water—achieving a sensitivity of 1.6965 +/− 0.2028 εr/pF. The use of laser ablation allowed the reduction of the transducer footprint while maintaining its sensitivity within an adequate value for the targeted applications.


2001 ◽  
Author(s):  
Chunjun Wang ◽  
Ramesh Ramadoss ◽  
Simone Lee ◽  
K. C. Gupta ◽  
Victor M. Bright ◽  
...  

Abstract This paper describes a new microelectromechanical systems (MEMS) switch fabricated using flexible circuit technologies. Hundreds of such switches can be laminated onto a large-area printed circuit board (PCB) with other RF devices and circuits. The switches are fabricated using low-cost, low-loss flexible circuit material Kapton-E polyimide film. Switches with actuation voltages as low as 73 V are reported.


2015 ◽  
Vol 102 ◽  
pp. 35-41 ◽  
Author(s):  
Youchun Xu ◽  
Shisheng Su ◽  
Changcheng Zhou ◽  
Ying Lu ◽  
Wanli Xing

2013 ◽  
Vol 192 ◽  
pp. 119-123 ◽  
Author(s):  
A. Luque ◽  
G. Flores ◽  
F. Perdigones ◽  
D. Medina ◽  
J. García ◽  
...  

2011 ◽  
Vol 133 (6) ◽  
Author(s):  
Abdallah H. Ramini ◽  
Mohammad I. Younis ◽  
Ronald Miles

Microelectromechanical systems (MEMS) are often used in portable electronic devices that are vulnerable to mechanical shock or impact, such as that induced due to accidental drops on the ground. This work presents a modeling and simulation effort to investigate the effect of the vibration of a printed circuit board (PCB) on the dynamics of MEMS microstructures when subjected to shock. Two models are investigated. In the first model, the PCB is modeled as an Euler-Bernoulli beam to which a lumped model of a MEMS device is attached. In the second model, a special case of a cantilever microbeam is studied and modeled as a distributed-parameter system, which is attached to the PCB. These lumped-distributed and distributed-distributed models are discretized into ordinary differential equations, using the Galerkin method, which are then integrated numerically over time to simulate the dynamic response. Results of the two models are compared against each other for the case of a cantilever microbeam and also compared to the predictions of a finite-element model using the software ANSYS. The influence of the higher order vibration modes of the PCB, the location of the MEMS device on the PCB, the electrostatic forces, damping, and shock pulse duration are presented. It is found that neglecting the effects of the higher order modes of the PCB and the location of the MEMS device can cause incorrect predictions of the response of the microstructure and may lead to failure of the device. It is noted also that, for some PCB designs, the response of the microstructure can be amplified significantly causing early dynamic pull-in and hence possibly failure of the device.


2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda

2013 ◽  
Vol 133 (4) ◽  
pp. 414-420 ◽  
Author(s):  
Tsuyoshi Suzuki ◽  
Takafumi Kobayashi ◽  
Kei Sawai ◽  
Kuniaki Kawabata ◽  
Fumiaki Takemura ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document