scholarly journals Reducing Subcarriers Beam-Squinting of Ultra-Wideband Mobile Communication Systems using Phased Array Antennas

Author(s):  
Dr. K. Rama Devi ◽  
◽  
M. Nani ◽  

There has been increasing demand for accessible radio spectrum with the rapid development of mobile wireless devices and applications. For example, a GHz of spectrum is needed for fifth-generation (5G) cellular communication, but the avail- able spectrum below 6 GHz cannot meet such requirements. Fortunately, spectrum at higher frequencies, in particular, millimeter-wave bands, can be utilized through phased-array analog beamforming to provide access to large amounts of spectrum. However, the gain provided by a phased array is frequency dependent in the wideband system, an effect called beam squint. We examine the nature of beam squint and develop convenient models with a uniform linear array. To further simplify the evaluation of the system performance, an approximated closed-form expression for the array gain is derived. Furthermore, to evaluate the performance of the proposed design, rigorous numerical results concerning different system parameters are provided in this paper.

IEEE Access ◽  
2021 ◽  
Vol 9 ◽  
pp. 129742-129755
Author(s):  
Thokala Latha ◽  
Gopi Ram ◽  
G. Arun Kumar ◽  
Mada Chakravarthy

2021 ◽  
Vol 2021 ◽  
pp. 1-6
Author(s):  
Yuyang Peng

With the rapid development of computer technology, electronic technology, and control technology, communication-based avionics systems can provide greater potential for the improvement of aircraft combat capabilities. Moreover, during the flight, passengers have an increasing demand for space communications. How to provide passengers with a communication-based aerospace electronic system that is indistinguishable from the ground during the flight is a problem that needs to be solved urgently. The research on the forward design method of this system has been highly valued by experts at home and abroad. This article is a communication-based forward design method for avionics systems. Based on the development of aerospace data communication technology, this article discusses the advantages of the application of the CCSDS (Consultative Committee for Space Data Systems) protocol in the design of aerospace electronic communication systems. This research designs the technical scheme of the entire aerospace communication electronic system and refers to the relevant CCSDS protocol to complete the design of the distributor’s fast transmission telemetry package and the distributor’s slow transmission telemetry package. This article introduces the two existing architectures of the integrated avionics system, compares and analyzes them, and then elaborates the integrated avionics system architecture based on trusted computing and the trust chain transfer mechanism. The experimental results show that the method designed in this paper uses the NBSP basic protocol in an aeronautical communication environment with a nesting depth of 2 s. When the data transmission delay is 2 s, the NBSP scheme is 0.9 and the NERON scheme is 0.4. This shows that the design method of this study is able to meet the requirements of the system and technical indicators.


2015 ◽  
Vol 77 (10) ◽  
Author(s):  
Khairul Huda Yusof ◽  
Norhudah Seman ◽  
Mohd Haizal Jamaluddin

Nowadays, the fifth generation (5G) wireless system is extensively studied to fulfill the continuously increasing demand for high data rate and mobility in wireless communication applications. Thus, to cope with this demand, various researches are required for front-end microwave components, which includes power divider. Therefore, in this article, the design and analysis of ultra wideband T-shaped power divider is presented. Two substrates are chosen in the design, which are Rogers RO4003C and TMM4 with copper thickness of 17 µm and 35 µm to analyze their effect towards ultra wideband performance of the designed power divider. The design and analysis are performed by using CST Microwave Studio. The optimal performance of the designed power divider is subjected to dielectric material and the copper thickness of the substrate. Where, the best design is obtained using TMM4 substrate that made of ceramic thermoset polymer with 35 µm copper thickness.


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