Dicing Laminated Wafer for QFN 3D Stacked Die Packaging

Semiconductor Photonics: Nano-Structured Materials and Devices - Advanced Materials Research ◽

10.4028/0-87849-471-5.202 ◽

2007 ◽

pp. 202-205

Author(s):

S. Abdullah ◽

Z. Endut ◽

I. Ahmad ◽

Azman Jalar ◽

Suhaila M. Yusof

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