The Effects of Different Architectures on Thermal Fatigue in Particle Reinforced MMC for Heat Sink Applications

2008 ◽  
Vol 59 ◽  
pp. 177-181 ◽  
Author(s):  
Michael Schöbel ◽  
G. Fiedler ◽  
Hans Peter Degischer ◽  
W. Altendorfer ◽  
Sebastien Vaucher
Keyword(s):  
Thermal Conductivity ◽  
Thermal Fatigue ◽  
Heat Sink ◽  
Coefficient Of Thermal Expansion ◽  
High Volume ◽  
Matrix Composites ◽  
Insulated Gate Bipolar Transistor ◽  
Igbt Modules ◽  
Synchrotron Tomography

Particle reinforced metal matrix composites are developed for heat sink applications. For power electronic devices like IGBT modules (Insulated Gate Bipolar Transistor) a baseplate material with high thermal conductivity combined with a low coefficient of thermal expansion is needed. Commonly AlSiC MMC are used with a high volume content of SiC particles (~ 70 vol.%). To improve the performance of these electronic modules particle reinforced materials with a higher thermal conductivity are developed for an advanced thermal management. For this purpose highly conducting diamond particles (TC ~ 1000 W/mK) are embedded in an Al matrix. These new diamond reinforced MMC were investigated concerning their thermal fatigue mechanisms compared to the common AlSiC MMC. Differences in reinforcement architecture and their effects on thermal fatigue damage were studied by in situ synchrotron tomography during thermal cycling.

The behaviour of aluminium matrix composites under thermal stresses

2016 ◽  
Vol 23 (1) ◽  
pp. 1-20 ◽  
Author(s):  
Khushbu Dash ◽  
Suvin Sukumaran ◽  
Bankim C. Ray
Keyword(s):  
Thermal Conductivity ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Thermal Stresses ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Interparticle Spacing ◽  
Aluminium Matrix ◽  
Matrix Composites ◽  
Aluminium Matrix Composites

AbstractThe present review work elaborates the behaviour of aluminium matrix composites (AMCs) under various kinds of thermal stresses. AMCs find a number of applications such as automobile brake systems, cryostats, microprocessor lids, space structures, rocket turbine housing, and fan exit guide vanes in gas turbine engines. These applications require operation at varying temperature conditions ranging from high to cryogenic temperatures. The main objective of this paper was to understand the behaviour of AMCs during thermal cycling, under induced thermal stresses and thermal fatigue. It also focuses on the various thermal properties of AMCs such as thermal conductivity and coefficient of thermal expansion (CTE). CTE mismatch between the reinforcement phase and the aluminium matrix results in the generation of residual thermal stress by virtue of fabrication. These thermal stresses increase with increasing volume fraction of the reinforcement and decrease with increasing interparticle spacing. Thermal cycling enhances plasticity at the interface, resulting in deformation at stresses much lower than their yield stress. Low and stable CTE can be achieved by increasing the volume fraction of the reinforcement. The thermal fatigue resistance of AMC can be increased by increasing the reinforcement volume fraction and decreasing the particle size. The thermal conductivity of AMCs decreases with increase in reinforcement volume fraction and porosity.

Effects of Melt Ultrasonic Treatment and Forming Processes on Thermo- Physical Properties of SiCp/Mg and (SiCp+Mg2Si)/Mg Composites

2021 ◽  
Vol 1035 ◽  
pp. 856-862
Author(s):  
Shu Sen Wu ◽  
Tian Guo ◽  
Shu Lin Lü ◽  
Wei Guo ◽  
Lan Qing Xia
Keyword(s):  
Thermal Conductivity ◽  
Ultrasonic Treatment ◽  
Coefficient Of Thermal Expansion ◽  
Gravity Casting ◽  
Average Coefficient ◽  
Molten Magnesium ◽  
Casting Porosity ◽  
Thermo Physical Properties ◽  
Thermal Conductivity Λ

The 10 vol% SiCp/Mg composites were prepared by external addition and stirring-casting method, and the hybrid reinforced (10 vol% SiCp+10 vol% Mg2Si)/Mg composites were prepared by combining in-situ method. The effects of melt ultrasonic treatment (UT) and forming processes on the thermophysical properties of the two composites were studied. The results show that UT can effectively disperse SiC particles in molten magnesium and reduce the casting porosity, while squeeze casting can significantly reduce the porosity of the composites, which can also significantly improve the thermal conductivity. The thermal conductivity (λ) of 10 vol.% SiCp/Mg composites squeeze casted after UT is 135.3 W/(mK) and the average coefficient of thermal expansion (CTE) is 19.95×10-6 K-1 at 293-373 K. Compared with gravity casting, the λ is increased by 17% and the CTE is reduced by 0.8%. The λ of (SiCp+Mg2Si)/Mg composite squeeze casted after UT is 132.4 W/(mK), and the CTE is 18.95×10-6 K-1, which is 27% lower than the CTE of pure magnesium.

Diamond/Al metal matrix composites formed by the pressureless metal infiltration process

1993 ◽  
Vol 8 (5) ◽  
pp. 1169-1173 ◽  
Author(s):  
William B. Johnson ◽  
B. Sonuparlak
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Metal Matrix Composites ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Matrix Composites ◽  
Infiltration Process ◽  
Point Bend ◽  
Aluminum Metal Matrix Composites ◽  
Metal Infiltration

Diamond particles are unique fillers for metal matrix composites because of their extremely high modulus, high thermal conductivity, and low coefficient of thermal expansion. Diamond reinforced aluminum metal matrix composites were prepared using a pressureless metal infiltration process. The diamond particulates are coated with SiC prior to infiltration to prevent the formation of Al4C3, which is a product of the reaction between aluminum and diamond. The measured thermal conductivity of these initial diamond/Al metal matrix composites is as high as 259 W/m-K. The effects of coating thickness on the physical properties of the diamond/Al metal matrix composite, including Young's modulus, 4-point bend strength, coefficient of thermal expansion, and thermal conductivity, are presented.

Fabrication by SPS and Thermophysical Properties of High Volume Fraction SiCp/Al Matrix Composites

2006 ◽  
Vol 313 ◽  
pp. 171-176 ◽  
Author(s):  
X.F. Gu ◽  
Lian Meng Zhang ◽  
Mei Jun Yang ◽  
Dong Ming Zhang
Keyword(s):  
Thermophysical Properties ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
High Volume ◽  
High Volume Fraction ◽  
Matrix Composites ◽  
Sic Particles ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Al Matrix Composites

SiCp/Al composites containing high volume fraction of SiC particles were fabricated by spark plasma sintering (SPS), and their thermophysical properties, such as thermal conductivity (TC) and coefficient of thermal expansion (CTE), were characterized. High relative density (R-D) of composites was successfully achieved through the optimization of sintering parameters, such as sintering temperature, sintering pressure and heating rate. The measured TCs of SiCp/Al composites fabricated by SPS are higher than 195W/m.k, no matter the volume fraction of SiC particles is high or low as long as the R-D is higher than 95%. The measured CTEs of SiCp/Al composites are in good agreement with the estimated values based on Kerner,s model. The high volume fraction of SiCp/Al composites are a good candidate material to substitute for conventional thermal management materials in advanced electronic packages due to its tailorable thermophysical properties.

Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix-Composites Fabricated by Spark Plasma Sintering (SPS)

2010 ◽  
Vol 638-642 ◽  
pp. 2115-2120 ◽  
Author(s):  
Kiyoshi Mizuuchi ◽  
Kanryu Inoue ◽  
Yasuyuki Agari ◽  
Shinji Yamada ◽  
Motohiro Tanaka ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Packing Density ◽  
Coefficient Of Thermal Expansion ◽  
Diamond Particle ◽  
Holding Time ◽  
Matrix Composites ◽  
Plasma Sintering ◽  
Spark Plasma

Diamond-particle-dispersed copper (Cu) matrix composites were fabricated from Cu-coated diamond particles by spark plasma sintering (SPS) process, and the microstructure and thermal properties of the composites fabricated were examined. These composites can well be consolidated in a temperature range between 973K and 1173K and scanning electron microscopy detects no reaction at the interface between the diamond particle and the Cu matrix. The relative packing density of the diamond-Cu composite increases with increasing sintering temperature and holding time, reaching 99.2% when sintered at a temperature of 1173K for a holding time of 2.1ks. Thermal conductivity of the diamond-Cu composite containing 43.2 vol. % diamond increases with increasing relative packing density, reaching a maximum (654W/mK) at a relative packing density of 99.2%. This thermal conductivity is 83% the theoretical value estimated by Maxwell-Eucken equation. The coefficient of thermal expansion of the composites falls in the upper line of Kerner’s model, indicating strong bonding between the diamond particle and the Cu matrix in the composite.

scholarly journals Technological Relevance, Research Prospect and Applications of Aluminium-Silicon Carbide-Graphite Hybrid Metal Matrix Composites for Thermal Characterization

2018 ◽  
Vol 8 (02) ◽  
Author(s):  
S A Mohan Krishna ◽  
T N Shridhar ◽  
L Krishnamurthy ◽  
K B Vinay ◽  
G V Naveen Prakash
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Hybrid Composites ◽  
Coefficient Of Thermal Expansion ◽  
Aluminium Matrix ◽  
Matrix Composites ◽  
Aluminium Matrix Composites ◽  
Research Prospect

Aluminium matrix composites belong to the family of materials whose mechanical, tribological, thermal and electrical properties can be customized effectively. Most of the commercial work on MMCs has been highlighted on Aluminium as the matrix material. The combination of light weight, environmental resistance and beneficial mechanical properties has made Aluminium alloys exceedingly popular; these properties also make Aluminium best suited for use as a matrix metal. The thermophysical properties of these composites can be tailor made and have excellent specific mechanical properties. These composites can be fabricated with ease. Aluminium matrix composites reinforced with the particles of Silicon Carbide possess high yield strength, low coefficient of thermal expansion or thermal expansivity, high modulus of elasticity and excellent wear resistance by maintaining volume proportion up to 20%. Aluminium hybrid composites can be customized to provide moderate Coefficient of Thermal Expansion (CTE) and high thermal conductivity that are favorable for the applications pertaining to thermal management equipment. However, it is necessary to evaluate different percentage combinations of reinforcements with matrix Aluminium to check for thermal stability and to measure thermal conductivity and coefficient of thermal expansion. It is expected that, Aluminium-Silicon Carbide-Graphite hybrid composites can be used as load bearing material for the above applications. In this paper, a review about the said hybrid composites to investigate thermal properties for engineering applications have been discussed based on its technological relevance, applications and research prospect.

Diamond-Based Metal Matrix Composites for Thermal Management Made by Liquid Metal Infiltration — Potential and Limits

2008 ◽  
Vol 59 ◽  
pp. 111-115 ◽  
Author(s):  
Ludger Weber ◽  
Reza Tavangar
Keyword(s):  
Thermal Conductivity ◽  
Metal Matrix Composites ◽  
Metal Matrix ◽  
Room Temperature ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Diamond Powder ◽  
Matrix Composites ◽  
Pressure Infiltration ◽  
The One

Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by gas pressure infiltration into diamond powder beds with the aim to maximize thermal conductivity and to explore the range of coefficient of thermal expansion (CTE) that can be covered. The resulting composites covered roughly the range between 60 and 75 vol-% of diamond content. For the Al-based composites a maximum thermal conductivity at room temperature of 7.6 W/cmK is found while for the Ag-3Si based composites an unprecedented value of 9.7 W/cmK was achieved. The CTE at room temperature varied as a function of the diamond volume fraction between 3.3 and 7.0 ppm/K and 3.1 and 5.7 ppm/K for the Al-based and the Ag-3Si-based composites, respectively. The CTE was further found to vary quite significantly with temperature for the Al-based composites while the variation with temperature was less pronounced for the Ag-3Si-based composites. The results are compared with prediction by analytical modeling using the differential effective medium scheme for thermal conductivity and the Schapery bounds for the CTE. For the thermal conductivity good agreement is found while for the CTE a transition of the experimental data from Schapery’s upper to Schapery’s lower bound is observed as volume fraction increases. While the thermophysical properties are quite satisfactory, there is a trade-off to be made in these materials between high thermal conductivity and low CTE on the one side and surface quality and machinability on the other.

scholarly journals Comparison of experimental and modelling results of thermal properties in Cu-AlN composite materials

2013 ◽  
Vol 61 (2) ◽  
pp. 507-514 ◽  
Author(s):  
M. Chmielewski ◽  
W. Weglewski
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Analytical Models ◽  
Matrix Composites ◽  
Pressing Method ◽  
3D Space ◽  
Automotive Electronic

Abstract Copper-based composites could be widely used in automotive, electronic or electrical industry due to their very promising thermal properties. In the present paper, Cu-AlN metal matrix composites with ceramic volume fractions between 0.1 and 0.4 were fabricated by hot pressing method in vacuum. Dependence of the coefficient of thermal expansion (CTE) and the thermal conductivity (TC) on the chemical composition of composites has been investigated. The measured values of the thermal expansion coefficient have been compared with the analytical models’ predictions. A numerical model based on FEAP 7.5 in 3D space has been used to evaluate the influence of the porosity on the thermal properties (thermal conductivity) of the composite. A fairly good correlation between the FEM results and the experimental measurements has been obtained.

scholarly journals Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
Da Yu ◽  
Hohyung Lee ◽  
Seungbae Park
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Failure Modes ◽  
Compressive Loading ◽  
Interfacial Thermal Resistance ◽  
Sac305 Solder

The ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove heat away from the device. A compressive loading is usually applied to reduce the interfacial thermal resistance between package and heat sink. In this paper, both experimental approaches and numerical modeling were employed to study the effect of compressive loading on the interconnect reliability under thermal cycling conditions. A special loading fixture which simulated the heat sink was designed to apply compressive loading to the package. The JEDEC standard thermal cycle tests were performed and the resistance of daisy chained circuits was in situ measured. The time to crack initiation and time to permanent failure were identified separately based on in situ resistance measurement results. Failure analysis has been performed to identify the failure modes of solder joint with and without the presence of compressive loading. A finite element based thermal-fatigue life prediction model for SAC305 solder joint under compressive loading was also developed to understand the thermal-fatigue crack behaviors of solder joint and successfully validated with the experimental results.

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