scholarly journals THERMAL DRILLING OPTIMIZATION IN MULTI HOLE PLATES

2021 ◽  
Vol 13 (2) ◽  
pp. 45-54
Author(s):  
Jan Kosmol ◽  
Keyword(s):  
Finite Element Method ◽  
Heat Exchangers ◽  
Thermal Deformation ◽  
Maximum Temperature ◽  
Drilling Machine ◽  
The Finite Element Method ◽  
Thermal Deformations ◽  
Drilling Optimization ◽  
Thermal Drilling ◽  
Axis Of Symmetry

The article presents the results of simulation of thermal deformations by the finite element method for round multi-hole plates used in heat exchangers. The heat generated when drilling holes causes thermal deformation of these objects, which contributes to errors in the location of the holes. Obtained results of simulation were compared for different drilling strategies (the studies considered 24 different strategies). It was found that the maximum drilling temperatures according to different strategies may differ by up to 100%. Similar conclusions can be drawn for thermal deformations. The general conclusion that results from the conducted research indicates the need to choose a strategy that ensures the symmetry of the drilled holes in relation to the axis of symmetry of the object. Then, both thermal deformation and maximum temperature are the smallest. The thus identified thermal deformations can form the basis for the correction of the coordinates of the holes on a CNC multi-spindle drilling machine.

The Effect of Curvature and Torsion on the Temperature Distribution in a Helix

1985 ◽  
Vol 52 (3) ◽  
pp. 529-532 ◽  
Author(s):  
D. D. Sayers ◽  
M. C. Potter
Keyword(s):  
Differential Equation ◽  
Finite Element Method ◽  
Partial Differential Equation ◽  
Temperature Distribution ◽  
Strong Dependence ◽  
Maximum Temperature ◽  
Nonuniform Heating ◽  
The Finite Element Method ◽  
Curvature Parameter ◽  
Curvature And Torsion

Traditional analysis treats the helix as a straight wire with the effects of nonuniform heating, torsion, and large curvature ignored. Using a helical coordinate system the governing partial differential equation including these effects is derived. The equation is then solved numerically using the finite element method. The results indicate a strong dependence of the temperature on the torsion parameter when the curvature parameter is significant. As the curvature parameter increases, the temperature distribution becomes skew-symmetric and the maximum temperature in the helix increases. Nonuniform heating influences the temperature distribution independent of the curvature and torsion.

scholarly journals An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias

Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1223
Author(s):  
Guangbao Shan ◽  
Guoliang Li ◽  
Dongdong Chen ◽  
Zifeng Yang ◽  
Di Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Finite Element Method ◽  
Thermal Model ◽  
Maximum Temperature ◽  
The Finite Element Method ◽  
Equivalent Thermal Conductivity ◽  
Thermal Distribution ◽  
Mathematical Expressions ◽  
Proposed Model ◽  
Silicon Vias

An accurate equivalent thermal model is proposed to calculate the equivalent thermal conductivity (ETC) of shield differential through-silicon via (SDTSV). The mathematical expressions of ETC in both horizontal and vertical directions are deduced by considering the anisotropy of SDTSV. The accuracy of the proposed model is verified by the finite element method (FEM), and the average errors of temperature along the X-axis, Y-axis, diagonal line, and vertical directions are 1.37%, 3.42%, 1.76%, and 0.40%, respectively. Compared with COMSOL, the proposed model greatly improves the computational efficiency. Moreover, the effects of different parameters on the thermal distribution of SDTSV are also investigated. The thermal conductivity is decreased with the increase in thickness of SiO2. With the increase in pitch, the maximum temperature of SDTSV increases very slowly when β = 0°, and decreases very slowly when β = 90°. The proposed model can be used to accurately and quickly describe the thermal distribution of SDTSV, which has a great prospect in the design of 3D IC.

A Novel Compact Method for Thermal Modeling of On-Chip Interconnects Based on the Finite Element Method

2003 ◽  
Author(s):  
Siva P. Gurrum ◽  
Yogendra K. Joshi ◽  
William P. King ◽  
Koneru Ramakrishna
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Thermal Modeling ◽  
Computational Cost ◽  
Compact Model ◽  
Maximum Temperature ◽  
The Finite Element Method ◽  
Detailed Model ◽  
Modeling Methodology ◽  
Element Method

Prediction of the temperature field generated with Joule heating in multilayer interconnect stacks is of critical importance for the design and reliability of future microelectronics. Interconnect failure due to electromigration is strongly dependent on its temperature. Simple models fail to capture thermal interaction between layers and within the layer. Detailed simulations on the other hand, take tremendous time and require large storage. This paper describes a threedimensional compact thermal modeling methodology that captures thermal interactions at a lower computational cost and storage requirements. The method is applicable for arbitrary geometries of interconnects due to the use of the finite element method. Case studies with three interconnects placed on a single level at a pitch of 1.0 μm generating different heat rates are reported. The compact model predicts a temperature rise of 4.11 °C at a current density of 10 MA/cm2 for 6.0 μm long interconnects of 0.18 μm width and an aspect ratio of 2. The error in maximum temperature is about 5% when compared with detailed simulations. The compact model for the current cases consists of 219 nodes whereas the detailed model has 99,000 nodes where temperature is computed.

scholarly journals The Assessment of the Residual Stresses Influence on Generation of the Infringement in Shape-Complex Supporting Members

2019 ◽  
Vol 69 (1) ◽  
pp. 85-96
Author(s):  
Miroslav Pástor ◽  
Peter Čarák ◽  
Imrich Gömöry
Keyword(s):  
Finite Element Method ◽  
Residual Stress ◽  
Finite Element ◽  
Numerical Modeling ◽  
Residual Stresses ◽  
The Other ◽  
Drilling Machine ◽  
The Finite Element Method ◽  
Drilling Method ◽  
Measured Residual Stress

AbstractThe aim of the paper is to assess the effect of residual stresses on the damage of the slide bearer. To quantify the residual stresses, the drilling method using SINT MTS 3000 drilling machine was chosen. The tensometric rosette application areas were determined based on the analysis of the results obtained by numerical modeling using the finite element method. Experimental measurement was performed on one unused slide bearer and on the other one, which during its present operation had completed about 9.106cycles. At the end of the paper, the analysis of the measured residual stress values in chosen locations is presented.

scholarly journals An Investigation of Convective Heat Transfer in a Rotating Coolant Channel

1990 ◽  
Author(s):  
J. O. Medwell ◽  
W. D. Morris ◽  
J. Y. Xia ◽  
C. Taylor
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Finite Element Method ◽  
Equations Of Motion ◽  
Turbine Blades ◽  
Solid Boundary ◽  
The Finite Element Method ◽  
Transfer Rates ◽  
Axis Of Symmetry

A numerical method is presented for the determination of heat transfer rates in a cylindrical cooling duct within turbine blades which rotate about an axis orthogonal to its own axis of symmetry. The equations of motion and energy are solved in conjunction with the k-ε model of turbulence using the finite element method. The predicted results are compared with experimental data and it is clearly demonstrated that conduction in the solid boundary must be taken into account if satisfactory agreement is to be achieved. Excluding these effects can lead to an over-estimation of the maximum wall temperature by approximately 50%.

Experimental and Numerical Analysis of Thermal Deformation in Thermoelectric Coolers

2011 ◽  
Vol 70 ◽  
pp. 399-404
Author(s):  
Wei Chung Wang ◽  
Ting Ying Wu
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Numerical Analysis ◽  
Thermal Deformation ◽  
Speckle Pattern ◽  
Electronic Speckle Pattern Interferometry ◽  
Thermoelectric Cooler ◽  
The Finite Element Method ◽  
Thermoelectric Coolers ◽  
Good Agreement

In this paper, the electronic speckle pattern interferometry (ESPI) and the finite element method (FEM) were used to obtain the thermal deformation induced in a centrally supported thermoelectric cooler (TEC). The results of ESPI and FEM are in good agreement and show that the warpage varies linearly with respect to the temperature difference between the two ceramic plates inside the TEC.

scholarly journals The veining structure method, the finite element method in thermal deformation determination for the main spindle at numerical control lathes

2005 ◽  
Vol 9 (1) ◽  
pp. 99-110
Author(s):  
Adrian But ◽  
Ioan Luminosu
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Complex Structure ◽  
Numerical Control ◽  
Initial Structure ◽  
The Finite Element Method ◽  
Thermal Deformations ◽  
Cnc Lathe ◽  
Main Spindle ◽  
Element Method

In the determination of the process accuracy on computer numerical control (CNC) lathe [1] it is very important to know the thermal deformations. This article presents a new solution to obtain the thermal deformations at the principal arbor (the most important part of a principal actuation for a CNC lathe) by using the element finite method. The first part of the theoretical aspect presents the steps of this method used especially for the principal arbor. The experimental part presents how this method was used to measure and process the signals. The experimental tests were applied in two different situations: (a) when material was catch only in principal arbor, and (b) when material was catch in principal arbor and chuck. The NASTRANMSC program was used, which has the possibility to determine the temperature values in the whole mass of the principal arbor and later the deformation temperature of every point of the ensemble was obtained. In order to analyze the thermal strain influence on the main spindle, the finite element method, the veining structure of a body was used. This is a method through which the "mother" (complex) structure was split in composing parts considered as independent (substructures). The link between different substructures in which the complex structure was split, is made on the common contour of substructures. The substructure becomes this way an independent structure with edge condition, constraint by assembly continuity of initial structure.

Numerical Evaluation of Fin Performance Under Dehumidifying Conditions

2007 ◽  
Vol 129 (10) ◽  
pp. 1395-1402 ◽  
Author(s):  
G. Comini ◽  
C. Nonino ◽  
S. Savino
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Heat Exchangers ◽  
Numerical Evaluation ◽  
Energy Equation ◽  
Air Cooling ◽  
The Finite Element Method ◽  
Moist Air ◽  
Compact Heat Exchangers ◽  
Coupled Problem

A numerical model of moist air cooling in compact heat exchangers is presented. The model requires the solution of a coupled problem, since interface temperatures, obtained from the solution of the energy equation in adjacent fluid and solid regions, are used to set the appropriate boundary conditions for the transport equation of water vapor in moist air. The approach is completely general, even if the finite-element method is used for the simulations reported in the paper. The numerical results are favorably compared with the corresponding experimental results concerning the rectangular and wavy fins under dehumidifying conditions.

scholarly journals Thermal Deformation Analysis of Cutting Tools by the Finite Element Method

1975 ◽  
Vol 41 (485) ◽  
pp. 512-519 ◽  
Author(s):  
Toshihiko AKIYAMA ◽  
Hisashi KAKUCHI ◽  
Tateshi KISHINAMI ◽  
Katsumasa SAITO
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Thermal Deformation ◽  
Cutting Tools ◽  
Deformation Analysis ◽  
The Finite Element Method ◽  
Element Method
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