acoustic microscopy
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2022 ◽  
Author(s):  
Wentian Chen ◽  
Chao Tao ◽  
Zizhong Hu ◽  
Songtao Yuan ◽  
Qinghuai Liu ◽  
...  

Abstract Photoacoustic imaging is a potential candidate for in-vivo brain imaging, whereas, its imaging performance could be degraded by inhomogeneous multi-layered media, consisted of scalp and skull. In this work, we propose a low-artifact photoacoustic microscopy (LAPAM) scheme, which combines conventional acoustic-resolution photoacoustic microscopy with scanning acoustic microscopy to suppress the reflection artifacts induced by multi-layers. Based on similar propagation characteristics of photoacoustic signals and ultrasonic echoes, the ultrasonic echoes can be employed as the filters to suppress the reflection artifacts to obtain low-artifact photoacoustic images. Phantom experiment is used to validate the effectiveness of this method. Furthermore, LAPAM is applied for in-vivo imaging mouse brain without removing the scalp and the skull. Experimental results show that the proposed method successfully achieves the low-artifact brain image, which demonstrates the practical applicability of LAPAM. This work might improve the photoacoustic imaging quality in many biomedical applications, which involve tissue with complex acoustic properties, such as brain imaging through scalp and skull.


Micromachines ◽  
2021 ◽  
Vol 12 (12) ◽  
pp. 1575
Author(s):  
Wenting Zhang ◽  
Caorui Zhang ◽  
Junmin Wu ◽  
Fei Yang ◽  
Yunlai An ◽  
...  

SiC direct bonding using O2 plasma activation is investigated in this work. SiC substrate and n− SiC epitaxy growth layer are activated with an optimized duration of 60s and power of the oxygen ion beam source at 20 W. After O2 plasma activation, both the SiC substrate and n− SiC epitaxy growth layer present a sufficient hydrophilic surface for bonding. The two 4-inch wafers are prebonded at room temperature followed by an annealing process in an atmospheric N2 ambient for 3 h at 300 °C. The scanning results obtained by C-mode scanning acoustic microscopy (C-SAM) shows a high bonding uniformity. The bonding strength of 1473 mJ/m2 is achieved. The bonding mechanisms are investigated through interface analysis by transmission electron microscopy (TEM) and energy dispersive X-ray spectroscopy (EDX). Oxygen is found between the two interfaces, which indicates Si–O and C–O are formed at the bonding interface. However, a C-rich area is also detected at the bonding interface, which reveals the formation of C-C bonds in the activated SiC surface layer. These results show the potential of low cost and efficient surface activation method for SiC direct bonding for ultrahigh-voltage devices applications.


2021 ◽  
Vol 2091 (1) ◽  
pp. 012045
Author(s):  
Y S Petronyuk ◽  
S A Titov ◽  
V M Levin

Abstract A new non-destructive express method for assessing the authenticity of numismatic material is considered in the paper. Non-destructive methods of pulsed acoustic microscopy in the frequency range of 50-100 MHz were applied. Samples of silver coins dated 1924 and 1979 were examined. The characteristic values of the longitudinal and transverse sonic velocity of the samples were obtained. The method of hydrostatic weighing was used to measure the density of the metal. It was shown that assessment of the authenticity and the safety degree of coins can also be carried out by revealing the internal defects such as corrosion. Acoustic visualization in the reflection mode allows imaging the offset of the obverse relative to the reverse and to determine the centre of the coin deviation, which also confirms the quality of the minting.


2021 ◽  
Author(s):  
Daniel Johnson ◽  
Po-Wei Hsu ◽  
Chengjie Xi ◽  
Navid Asadizanjani

Abstract The supply chain of the semiconductor industry is experiencing painful growth and advancement in chip development with the help of recently passed U.S legislation and funding to address a chip shortage. However, it is not without some drawbacks, one of which is the challenge of maintaining control over the manufacturing quality throughout the entire process. As a result of this, physical inspection for hardware security is a necessity to assure the semiconductor devices. In this paper, various physical inspection methods are reviewed and scanning acoustic microscopy (SAM) is proved to be the ideal physical inspection method to minimize the possibility of counterfeits which might be the feasible solution in detecting counterfeits on a large scale.


Measurement ◽  
2021 ◽  
pp. 110306
Author(s):  
Prakhar Kumar ◽  
Nitin Yadav ◽  
Muhammad Shamsuzzaman ◽  
Krishna Agarwal ◽  
Frank Melandsø ◽  
...  

2021 ◽  
Author(s):  
George Angelov ◽  
Radostin Rusev ◽  
Dimitar Nikolov ◽  
Rostislav Rusev

2021 ◽  
Author(s):  
P.L.M.J. van Neer ◽  
B.A.J. Quesson ◽  
M.S. Tamer ◽  
K. Hatakeyama ◽  
M.H. van Es ◽  
...  

Function ◽  
2021 ◽  
Author(s):  
Stuart J Keppie ◽  
Jessica C Mansfield ◽  
Xiaodi Tang ◽  
Christopher J Philp ◽  
Helen K Graham ◽  
...  

Abstract Articular cartilage is a dense extracellular matrix-rich tissue that degrades following chronic mechanical stress, resulting in osteoarthritis (OA). The tissue has low intrinsic repair especially in aged and osteoarthritic joints. Here we describe three pro-regenerative factors; fibroblast growth factor 2 (FGF2), connective tissue growth factor, bound to transforming growth factor-beta (CTGF-TGFβ), and hepatoma-derived growth factor (HDGF), that are rapidly released from the pericellular matrix (PCM) of articular cartilage upon mechanical injury. All three growth factors bound heparan sulfate, and were displaced by exogenous NaCl. We hypothesised that sodium, sequestered within the aggrecan-rich matrix, was freed by injurious compression, thereby enhancing the bioavailability of pericellular growth factors. Indeed, growth factor release was abrogated when cartilage aggrecan was depleted by IL-1 treatment, and in severely damaged human osteoarthritic cartilage. A flux in free matrix sodium upon mechanical compression of cartilage was visualised by 23Na magnetic resonance imaging (MRI) just below the articular surface. This corresponded to a region of reduced tissue stiffness, measured by scanning acoustic microscopy and second harmonic generation microscopy, and where Smad2/3 was phosphorylated upon cyclic compression. Our results describe a novel intrinsic repair mechanism, controlled by matrix stiffness and mediated by the free sodium concentration, in which heparan sulfate-bound growth factors are released from cartilage upon injurious load. They identify aggrecan as a depot for sequestered sodium, explaining why osteoarthritic tissue loses its ability to repair. Treatments that restore matrix sodium to allow appropriate release of growth factors upon load are predicted to enable intrinsic cartilage repair in osteoarthritis. Significance Statement Osteoarthritis is the most prevalent musculoskeletal disease, affecting 250 million people worldwide1. We identify a novel intrinsic repair response in cartilage, mediated by aggrecan-dependent sodium flux, and dependent upon matrix stiffness, which results in the release of a cocktail of pro-regenerative growth factors after injury. Loss of aggrecan in late-stage osteoarthritis prevents growth factor release and likely contributes to disease progression. Treatments that restore matrix sodium in osteoarthritis may recover the intrinsic repair response to improve disease outcome.


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