thermal curing
Recently Published Documents


TOTAL DOCUMENTS

279
(FIVE YEARS 62)

H-INDEX

27
(FIVE YEARS 4)

2022 ◽  
Vol 22 (1) ◽  
pp. 147-160
Author(s):  
Cristiane do Bom Conselho Sales Alvarenga ◽  
Rosemary do Bom Conselho Sales ◽  
Rodrigo Barreto Caldas ◽  
Paulo Roberto Cetlin ◽  
Maria Teresa Paulino Aguilar

Abstract Metakaolinis the principal raw material utilized in the synthesis of geopolymers, although its ratio of silica and alumina contents is not ideal. Normally, the SiO2 content is adjusted with the use of silicates present in the activating solution. An eco-efficient alternative would be the use of glass waste as an additional source of silica.This work evaluates the efficiency of the alkaline activation of metakaolin, using potassium hydroxide and silicate, with and without the substitution of 12.5% of metakaolin by microparticles of glass. The efficiency of the alkaline activation was evaluated by X ray diffractometry, spectroscopy in the infrared region with the Fourier transform, nuclear magnetic resonance spectroscopy of 27Al and 29Si, specific mass and compressive strength. The results indicate the occurrence of geopolymerization with and without the use of glass waste. It was observed that the substitution of 12.5% favors the mechanical performance of the compounds at 28 days, with increases by 37% and 47% in the mechanical strength of the material with thermal curing and ambient temperature curing, respectively.


Materials ◽  
2022 ◽  
Vol 15 (2) ◽  
pp. 547
Author(s):  
Charlotte Dewitte ◽  
Alexandra Bertron ◽  
Mejdi Neji ◽  
Laurie Lacarrière ◽  
Alexandre Dauzères

Concretes can be exposed to a magnesium attack in several environments leading to the formation of magnesium silicate hydrates (M-S-H) and brucite (MH). The formation of M-S-H is likely to alter the properties of the cement matrix because it is linked to the decalcification of C-S-H. However, relatively few data on M-S-H exist in the literature. In order to characterize, physically and mechanically, the M-S-H phase, pure M-S-H cohesive pastes are needed. This work studies the formation of cohesive M-S-H pastes made with MgO-to-SiO2 atomic ratios of 0.78, 1 and 1.3, from two types of silica (silica fume or colloidal silica) and under 20 °C and 50 °C thermal curing. X-ray diffraction and thermogravimetric analyses confirmed that the consumption of brucite and the formation of M-S-H were quicker with a 50 °C curing. Energy-dispersive X-ray spectroscopy and microtomography showed that colloidal silica enabled a better distribution of the particles than silica fume. Microstructural characterizations were conducted under the protocol with colloidal silica and 50 °C thermal curing. Porosity investigations allowed to describe the M-S-H pastes as highly porous materials with a low content of micropores in comparison with mesopores. The type of mixing influenced the mesopore size distribution.


Materials ◽  
2021 ◽  
Vol 14 (21) ◽  
pp. 6548
Author(s):  
Xian Li ◽  
Nan Zhong ◽  
Huan Hu ◽  
Yufan Zhang ◽  
Yawen Huang ◽  
...  

Benzocyclobutene-modified silsesquioxane (BCB-POSS) and divinyl tetramethyl disiloxane-bisbenzocyclobutene (DVS-BCB) prepolymer were introduced into the containing benzocyclobutene (BCB) unit matrix resin P(4-MB-co-1-MP) polymerized from 1-methyl-1-(4-benzocyclobutenyl) silacyclobutane (4-MSCBBCB) and 1-methyl-1-phenylsilacyclobutane (1-MPSCB), respectively. The low dielectric constant (low-k) siloxane/carbosilane hybrid benzocyclobutene resin composites, P(4-MB-co-1-MP)/BCB-POSS and P(4-MB-co-1-MP)/DVS-BCB, were prepared. The curing processes of the composites were assessed via Fourier-transform infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). The effects on dielectric properties and heat resistance of those composites with different proportion of BCB-POSS and DVS-BCB were investigated using an impedance analyzer and thermogravimetric analyzer (TGA), respectively. The thermal curing of composites could be carried out by ring-opening polymerization (ROP) of the BCB four-member rings of BCB-POSS or DVS-BCB and those of P(4-MB-co-1-MP). With increasing the proportion of BCB-POSS to 30%, the 5% weight loss temperature (T5%) of P(4-MB-co-1-MP)/BCB-POSS composites was raised visibly, whereas the dielectric constant (k) was decreased owing to the introduction of nanopores into POSS. For P(4-MB-co-1-MP)/DVS-BCB composites, the T5% and k were slightly raised with increasing the proportion of DVS-BCB. The above results indicated that the BCB-POSS showed advantages over conventional fillers to simultaneously improve thermostability and decrease k.


2021 ◽  
Vol 2 (1) ◽  
Author(s):  
Joel Bachmann ◽  
Philip Obst ◽  
Lukas Knorr ◽  
Stefan Schmölzer ◽  
Gabriele Fruhmann ◽  
...  

AbstractVat photopolymerisation describes resin-based additive manufacturing processes in which ultraviolet light is used to layer-wise solidify liquid resin into a desired 3D shape. If the starting resin is a dual-curing formulation the object is also thermally cured to attain its final properties, obtaining either an elastomer or a thermoset. Here, we introduce cavity vat photopolymerisation, in which one photopolymer resin produces a composite material of an elastomer and thermoset. Cavities of any geometry are purposefully designed in the solid object and then filled with liquid resin during printing due to negative pressure. Thermal curing then solidifies the resin in the cavities into an elastomer, forming a distinct interface held together by strong covalent bonds. Hybrid specimens indicate improved damping, reduced fragmentation upon fracture and increased local elasticity, and we suggest several hard-shell/soft-core applications that might benefit.


2021 ◽  
Author(s):  
Dila Türkmen ◽  
Merve Acer Kalafat

In this paper we present the lamination curing as a stand-alone method to activate the silver nanoparticle (Ag NP) inkjet printed angle sensors on a 0.14 mm PET substrate, with a desktop printer. (With the term “lamination curing”, we refer passing the printed sample through a lamination machine, without any actual laminating purpose, only for curing.) We compared the method with the oven curing, which is the widest used method for the intended sensors, and found that lamination cured sensors give lower sheet resistance, lower fabrication uncertainty and more consistent angle sensing behaviors with higher sensing performance. Different curing parameters are inspected and a process under 3 minutes is achieved giving a 0.06 Ohm/square sheet resistance. For such a low sheet resistance, presented method has the lowest thermal curing time among all single layer Ag NP printing studies in the literature. An experimental model is presented for the sheet resistance - aspect ratio relation for both methods. Time dependent resistance shifts of the lamination cured sensors are also inspected and proved to be insignificant. We state lamination curing as an advantageous and reliable alternative to oven curing and other fast curing methods both for sensor and circuitry printing implementations.


2021 ◽  
Author(s):  
Dila Türkmen ◽  
Merve Acer Kalafat

In this paper we present the lamination curing as a stand-alone method to activate the silver nanoparticle (Ag NP) inkjet printed angle sensors on a 0.14 mm PET substrate, with a desktop printer. (With the term “lamination curing”, we refer passing the printed sample through a lamination machine, without any actual laminating purpose, only for curing.) We compared the method with the oven curing, which is the widest used method for the intended sensors, and found that lamination cured sensors give lower sheet resistance, lower fabrication uncertainty and more consistent angle sensing behaviors with higher sensing performance. Different curing parameters are inspected and a process under 3 minutes is achieved giving a 0.06 Ohm/square sheet resistance. For such a low sheet resistance, presented method has the lowest thermal curing time among all single layer Ag NP printing studies in the literature. An experimental model is presented for the sheet resistance - aspect ratio relation for both methods. Time dependent resistance shifts of the lamination cured sensors are also inspected and proved to be insignificant. We state lamination curing as an advantageous and reliable alternative to oven curing and other fast curing methods both for sensor and circuitry printing implementations.


2021 ◽  
Vol 63 (5) ◽  
pp. 553-567
Author(s):  
Fangling Wang ◽  
Shengling Jiang ◽  
M. D. Kejmakh ◽  
E. S. Afanasiev ◽  
A. S. Peregudov ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document