An extended invariant approach to laminate failure of fibre-reinforced polymer structures

This paper presents the extension and validation of omni-failure envelopes for first-ply failure (FPF) and last-ply failure (LPF) analysis of advanced composite materials under general three-dimensional (3D) stress states. Phenomenological failure criteria based on invariant structural tensors are implemented to address failure events in multidirectional laminates using the “omni strain failure envelope” concept. This concept enables the generation of safe predictions of FPF and LPF of composite laminates, providing reliable and fast laminate failure indications that can be particularly useful as a design tool for conceptual and preliminary design of composite structures. The proposed extended omni strain failure envelopes allow not only identification of the controlling plies for FPF and LPF, but also of the controlling failure modes. FPF/LPF surfaces for general 3D stress states can be obtained using only the material properties extracted from the unidirectional (UD) material, and can predict membrane FPF or LPF of any laminate independently of lay-up, while considering the effect of out-of-plane stresses. The predictions of the LPF envelopes and surfaces are compared with experimental data on multidirectional laminates from the first and second World-Wide Failure Exercise (WWFE), showing a satisfactory agreement and validating the conservative character of omni-failure envelopes also in the presence of high levels of triaxiality.

Mechanical Behaviour and Failure Mode of High Interstitially Alloyed Austenite under Combined Compression and Cyclic Torsion

multiaxial stress states frequently occur in technical components and, due to the multitude of possible load situations and variations in behaviour of different materials, are to date not fully predictable. This is particularly the case when loads lie in the plastic range, when strain accumulation, hardening and softening play a decisive role for the material reaction. This study therefore aims at adding to the understanding of material behaviour under complex load conditions. Fatigue tests conducted under cyclic torsional angles (5°, 7.5°, 10° and 15°), with superimposed axial static compression loads (250 MPa and 350 MPa), were carried out using smooth specimens at room temperature. A high nitrogen alloyed austenitic stainless steel (nickel free), was employed to determine not only the number of cycles to failure but particularly to aid in the understanding of the mechanical material reaction to the multiaxial stresses as well as modes of crack formation and growth. Experimental test results indicate that strain hardening occurs under the compressive strain, while at the same time cyclic softening is observable in the torsional shear stresses. Furthermore, the cracks’ nature is unusual with multiple branching and presence of cracks perpendicular in direction to the surface cracks, indicative of the varying multiaxial stress states across the samples’ cross section as cross slip is activated in different directions. In addition, it is believed that the static compressive stress facilitated the Stage I (mode II) crack to change direction from the axial direction to a plane perpendicular to the specimen’s axis.

Microstructural Dynamics of the Myocardium: Orientation of the Muscle Fibers and Occurrence of Cardiomyopathies

This paper considers the Holzapfel–Ogden (HO) model to examine the behavior of the left ventricle myocardium. At the tissue level, we analyze the contributions of the orientation angle of muscle fibers (MFs) and investigate their effects on the occurrence of certain cardiomyopathies and congenital diseases at the organ level. Knowing the importance of myocardial microstructure on cardiac function, we vary the angle between the direction of collagen sheets and MFs in all layers of the myocardium (from epicardium to endocardium) to model the effects of tilted MFs. Based on the HO model in which the directions of the fibers are orthogonal and using the strain energy of HO, we construct a tensile-compression test and simulate the dynamics of a cubic sample. We recover the authors’ results exhibiting the existence of residual stresses in various directions. Then, we modify the energy of HO slightly to assess the impact of the same stress states on the system with tilted MFs. A numerical tensile-compression test performed on this new cubic sample shows that, in certain directions, the heart tissue is more resistant to shear deformations in some planes than in others. Moreover, it appears that the residual stress is smaller as the angle of orientation of the MFs is small. Furthermore, we observe that the residual stress is greater in the new model compared to the normal HO model. This could affect the heart muscle at the organ level leading to hypertrophied/dilated cardiomyopathy.

Force and Microstructure Variation of SLM Prepared AlMgSc Samples during Three-Point Bending

Lightweight parts manufactured by metal selective laser melting (SLM) are widely applied in machinery industries because of their high specific strength, good energy absorption effect, and complex shape that are difficult to form by mechanical machining. These samples often serve in three-dimensional stress states. However, previous publications mainly focused on the unidirectional tensile/compressive properties of the samples. In this paper, AlMgSc samples with different geometric parameters were prepared by the SLM process, and the variation of force and microstructure during three-point bending were systematically investigated. The results demonstrate that the deformation resistance of these samples has good continuity without mutation in bending, even for brittle materials; the bending force-displacement curves exhibit representative variation stages during the entire bending process; the equivalent bending strength deduced from free bending formula is not applicable when compactability is less than 67%. The variations of grain orientation and size of the three representative bending layers also show regularity.

Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures

PurposeAs the solution to improve fatigue life and mechanical reliability of packaging structure, the material selection in PCB stack-up and partitioning design on PCB to eliminate the electromagnetic interference by keeping all circuit functions separate are suggested to be optimized from the mechanical stress point of view.Design/methodology/approachThe present paper investigated the effect of RO4350B and RT5880 printed circuit board (PCB) laminates on fatigue life of the QFN (quad flat no-lead) packaging structure for high-frequency applications. During accelerated thermal cycling between −50 °C and 100 °C, the mismatched coefficients of thermal expansion (CTE) between packaging and PCB materials, initial PCB warping deformation and locally concentrated stress states significantly affected the fatigue life of the packaging structure. The intermetallics layer and mechanical strength of solder joints were examined to ensure the satisfactorily soldering quality prior to the thermal cycling process. The failure mechanism was investigated by the metallographic observations using a scanning electron microscope.FindingsTypical fatigue behavior was revealed by grain coarsening due to cyclic stress, while at critical locations of packaging structures, the crack propagations were confirmed to be accompanied with coarsened grains by dye penetration tests. It is confirmed that the cyclic stress induced fatigue deformation is dominant in the deformation history of both PCB laminates. Due to the greater CTE differences in the RT5880 PCB laminate with those of the packaging materials, the thermally induced strains among different layered materials were more mismatched and led to the initiation and propagation of fatigue cracks in solder joints subjected to more severe stress states.Originality/valueIn addition to the electrical insulation and thermal dissipation, electronic packaging structures play a key role in mechanical connections between IC chips and PCB.

Effect of Pin Geometry and Orientation on Friction and Wear Behavior of Nickel-Coated EN8 Steel Pin and Al6061 Alloy Disc Pair

Most mechanical systems (in particular, gear transmission system) undergo relative motion which results in increased friction phenomenon (friction coefficient, stresses, and wear rate) and thereby results in loss of efficiency. Mechanical parts undergo relative motion in different geometry configurations and orientations that induce a different state of stress as a result of friction. Till date, attempts are being made to minimize the friction with full sphere pin geometry configuration. The present work focused to reduce the frictional and wear rate, and experiments are conducted with tribo-pairs. i.e., nickel-coated pin surface slide against Al6061 alloy disc. The friction studies are carried out at different loads and geometries of pin surfaces (sphere and hemisphere configured at different orientations such as full sphere and hemisphere configured at 0°, 45°, and 90°) to induce different stress states with reference to sliding directions. Change in the geometry of EN8 pin material and their orientation with reference to sliding direction resulted in a different state of stress. The resulting stress levels were examined under the scanning electron microscope, which revealed the mechanisms of adhesion, abrasion, and extrusion. At a lower magnitude of orientation and load, the extent of asperity breaking lessens and material removal from pin surface decreases. Abrasion wear mechanism was observed corresponding to full sphere configuration on Al 6061 disc, whereas adhesive wear mechanisms are seen with hemisphere pins. The amount of aluminum transfer on pin surface with a hemisphere pin is comparatively more than that of full sphere configuration. At a lower magnitude of state of stress, the mechanism of sliding was dominated by the adhesion effect. At a higher level of state of stress, the mechanism of sliding was dominated by abrasion and extrusion.