Simulation of control and stabilization of the lubricant-coolant flow

The subject of the research is a control system of coolant supply. The results of system simulation in MathLab application program package for solving problems of technical calculations are presented and the analysis of transients is carried out. Reliability and productivity of a machine tool module depends on the quality of coolant supply control. This problem is actual for CNC machines, used for drilling holes with hard-alloy drills. of cutting fluid through the cutting zone depends on the state of chips in the drill hole channels. In the article the simulation of pump control as a function of changing flow rate is performed. The conclusion of the conducted research is the proposed model of the system of supply and flow of lubrication-cooling fluid, which allows analyzing the performance of the object under study.

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

A 10 kW scale model of a decoupled immersion cooling rig is constructed in order to serve as a testbed for immersion cooling, using 3M FC3284 dielectric cooling fluid. A species separator is constructed and demonstrates an ability to remove air from the flowfield before the condensable gases enter the condenser vessel, verified with Schlieren photography. The condenser underperformed significantly compared to initial sizing calculations using the NTU method, and film thickness of FC3284 liquid on the surface of the condenser was determined to be the cause due to low thermal conductivity of the liquid. The average film thickness on the surface of the condenser is calculated. In addition to the performance detriment of the film, air is also shown to reduce the condenser’s performance. The height of a transient stratification line is measured and compared against condenser power. Condenser efficacy losses are large and variable based on the concentration of air in the condenser vessel. A low vs high-mounted boiler is investigated. The mounting of the boiler has an effect on how much vapor is lost during a maintenance event. Finally, a comparison of the test rig’s overall cooling efficiency is made with various air-cooled datacenters by tracking energy consumption to cool a given IT load. This also translates to a reduction in carbon emissions.

Optimization of fins arrangements for the square light emitting diode (LED) cooling through nanofluid-filled microchannel

In current paper, a finned micro-channel is designed for the cooling application in Light Emitting Diode (LED), numerically using Galerkin weighted residual Finite Element Method (GFEM). Selected materials for LED-chip is GaN, Die from Si, Die-attach is made by Au-20Sn, substrate is copper and heat sink material is considered to be Al. To make a convection heat transfer for cooling process, Al2O3-water nanofluid is used as the cooling fluid flow through the micro-channel and tried to maximize the heat transfer efficiency by optimized geometry. For this aim, there geometry variables from the microchannel were selected and minimum possible geometry cases (11 cases) were proposed by Central composite design (CCD) and variables were optimized by the Response Surface Method (RSM). As a main result, parameter B, i.e. fin length had the most effect on the Nusselt number and Al2O3 nanoparticles with φ = 0.05 stated greatest heat transfer value. Also, different designs of fins arrangements, caused up to 6.5% increase in the nanofluid temperature which enhanced the LED cooling process.

Mineral Oil As an Alternative Cooling Method

In an effort to increase the performance ceiling and reduce the size of modern personal computers especially gaming computers and consequently data centers and supercomputers, mineral oil is proposed as the working fluid to cool the system. Mineral oil operates as an avenue for transmission rather than a liquid heatsink for heat storage, which differentiates this project from traditional mineral oil systems. Using non-conductive liquid as cooling fluid brings many advantages due to its higher convective heat transfer coefficient, which leads to more compact computers, higher speed of data transition, more efficient processors, lower noise levels, and less upkeep costs with respect to data centers. Modeling and simulations are done in NX to gauge temperature expectations; which is the most important limitation when designing and testing a computer before construction. The temperature range was found to be 34°C–50°C in the motherboard and 45°C–67°C in the graphic card. Based on the modeling results, a prototype of the proposed computer is built and tested. Ultimately, this project is trying to open up an avenue through which processor design can be reconsidered.