integrated microsystems
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2022 ◽  
Vol 9 ◽  
Author(s):  
Xiangfei Sun ◽  
Kunfeng Chen ◽  
Feng Liang ◽  
Chunyi Zhi ◽  
Dongfeng Xue

The rapid development of portable, wearable, and implantable electronic devices greatly stimulated the urgent demand for modern society for multifunctional and miniaturized electrochemical energy storage devices and their integrated microsystems. This article reviews material design and manufacturing technology in different micro-supercapacitors (MSCs) along with devices integrate to achieve the targets of their various applications in recent years. Finally, We also critically prospect the future development directions and challenges of MSCs.


2022 ◽  
Author(s):  
Sangwook Bae ◽  
Yong-Wo Kim ◽  
Jeong-Yun Sun ◽  
Sunghoon Kwon

Noncovalent hydrogels, compared to covalent hydrogels, have distinctive advantages including biocompatibility and self-healing property but tend to have poor mechanical robustness, thus restricting their application spectrum. A clue to increase utility of such soft hydrogels without chemical bulk modification can be witnessed in biological organ walls where soft mucous epithelial layers are juxtaposed with tough connective tissues. Perhaps, similarly, bonding noncovalent hydrogels to stronger materials, such as tough hydrogels, might be a viable approach for increasing stability and scalability as well as creating novel functions for hydrogel-based systems. However when attempting to bond these two materials, each of the four existing hydrogel-hydrogel bonding method has practical shortcomings. In this work, we introduce a mucosa-inspired bonding method that realizes interfacial bonding of noncovalent hydrogels to tough, hybrid hydrogels without external glue or bulk modification of the noncovalent gel while preserving interfacial micropatterns. The procedure is simple and we confirmed broad applicability with various noncovalent hydrogels and tough hydrogels. We demonstrated the utility of our bonding method with novel applications regarding in vitro assay, soft robotics and biologically inspired systems.


Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 158
Author(s):  
Peng Huang ◽  
Dan-Liang Wen ◽  
Yu Qiu ◽  
Ming-Hong Yang ◽  
Cheng Tu ◽  
...  

In recent years, wearable electronic devices have made considerable progress thanks to the rapid development of the Internet of Things. However, even though some of them have preliminarily achieved miniaturization and wearability, the drawbacks of frequent charging and physical rigidity of conventional lithium batteries, which are currently the most commonly used power source of wearable electronic devices, have become technical bottlenecks that need to be broken through urgently. In order to address the above challenges, the technology based on triboelectric effect, i.e., triboelectric nanogenerator (TENG), is proposed to harvest energy from ambient environment and considered as one of the most promising methods to integrate with functional electronic devices to form wearable self-powered microsystems. Benefited from excellent flexibility, high output performance, no materials limitation, and a quantitative relationship between environmental stimulation inputs and corresponding electrical outputs, TENGs present great advantages in wearable energy harvesting, active sensing, and driving actuators. Furthermore, combined with the superiorities of TENGs and fabrics, textile-based TENGs (T-TENGs) possess remarkable breathability and better non-planar surface adaptability, which are more conducive to the integrated wearable electronic devices and attract considerable attention. Herein, for the purpose of advancing the development of wearable electronic devices, this article reviews the recent development in materials for the construction of T-TENGs and methods for the enhancement of electrical output performance. More importantly, this article mainly focuses on the recent representative work, in which T-TENGs-based active sensors, T-TENGs-based self-driven actuators, and T-TENGs-based self-powered microsystems are studied. In addition, this paper summarizes the critical challenges and future opportunities of T-TENG-based wearable integrated microsystems.


Author(s):  
Sungho Kang ◽  
Vageeswar Rajaram ◽  
Sila Deniz Calisgan ◽  
Antea Risso ◽  
Zhenyun Qian ◽  
...  

2021 ◽  
Vol 255 ◽  
pp. 10001
Author(s):  
Antonio d’Alessandro ◽  
Anju M. Kumaran

In this paper technology to make optical waveguides and microfluidic channels integrated on the same substrate will be reported to envisage novel micro-optofluidic chips. PolyDiMethylSiloxane (PDMS) is used to make microchannels to be filled with biological solutions. Liquid crystals (LC) are used to confine light to produce optical interaction with biological fluidic specimen. Optical waveguides base on PDMS channels filled with LC, named LC:PDMS waveguides, including both straight and bending channels are reported to design photonic devices. Electro-optic effect of LC allows to make tuneable optical waveguides to reconfigure the entire optofluidic microsystem which can include gold nanoparticles for photo-thermal therapies. Coplanar gold electrodes can switch LC molecules with applied voltage of about 2 V. Such electrode configuration can be used to make optical switches and wavelengths demultiplexers. A zero-gap directional coupler based on LC:PDMS waveguides has been designed to switch light from one waveguide to another with an extinction ratio of 16 dB by applying a voltage of just 1.62 V. A multimode interference demultiplexer has been also designed to demultiplex wavelengths at 980 nm and 1550 nm in two output waveguides with an extinction ratio better than 11 dB by applying about 7 V.


Electronics ◽  
2020 ◽  
Vol 9 (5) ◽  
pp. 766
Author(s):  
Hao Lv ◽  
Shengbing Zhang ◽  
Wei Han ◽  
Yongqiang Liu ◽  
Shuo Liu ◽  
...  

In recent years, microelectronics technology has entered the era of nanoelectronics/integrated microsystems. System in Package (SiP) and System on Chip (SoC) are two important technical approaches for microsystems. The development of micro-system technology has made it possible to miniaturize airborne and missile-borne electronic equipment. This paper introduces the design and implementation of an aerospace miniaturized computer system. The SiP chip uses Xilinx Zynq® SoC (2ARM® + FPGA), FLASH memory and DDR3 memory as the main components, and integrates with SiP high-density system packaging technology. The chip has the advantages of small size and ultra-low power consumption compared with the traditional PCB circuit design. A pure software-based DDR3 signal eye diagram test method is used to verify the improvement inf the signal integrity of the chip without the need for probe measurement. The method of increasing the thermal conductive silver glue was used to improve the thermal performance after the test and analysis. The SiP chip was tested and analyzed with other mainstream aviation computers using a heading measurement of extended Kalman filter (EKF) algorithm. The paper has certain reference value and research significance in the miniaturization of the aviation computer system, the heat dissipation technology of SiP chip and the test method of signal integrity.


The Analyst ◽  
2020 ◽  
Vol 145 (6) ◽  
pp. 2405-2411 ◽  
Author(s):  
Hyun Jin Yoo ◽  
Changyoon Baek ◽  
Min-Ho Lee ◽  
Junhong Min

An in situ detection system compatible with LAMP that can detect the dengue virus and discriminate between its serotypes in the whole blood.


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