The conventional electromagnetic interference (EMI) shielding materials are being gradually replaced by a new generation of supported conducting polymer composites (CPC) films due to their many advantages. This work presents a contribution on the effects of silane surface–modified flexible polypyrrole-silver nanocomposite films on the electromagnetic interference shielding effectiveness (EMI-SE). Thus, the UV-polymerization was used to in-situ deposit the PPy-Ag on the biaxial oriented polyethylene terephthalate (BOPET) flexible substrates whose surfaces were treated by 3-aminopropyltrimethoxysilane (APTMS). X-ray Photoelectron Spectroscopy (XPS) analyzes confirmed the APTMS grafting procedure. Structural, morphological, thermal, and electrical characteristics of the prepared films were correlated to the effect of substrate surface treatment. Thereafter, EMI-SE measurements of the elaborated films were carried out as per ASTM D4935 standard for a wide frequency band extending from 50 MHz to 18 GHz. The obtained results confirmed that the APTMS-treated BOPET film exhibit higher EMI shielding performance and better electrical characteristics compared to the untreated film. In fact, a 32% enhancement of EMI-SE was noted for the treated films compared to the untreated ones. Overall, these results put forward the role played by the surface treatment in strengthening the position of flexible PPy-Ag supported films as high-performance materials in electronic devices and electromagnetic interference shielding applications.
The present work is focused on the fabrication of manganese dioxide/carbon dots (MnO2/CDs) nanocomposites at room temperature in situ co-participation method in an aqueous medium and characterized. Our study showed that the concentration of CDs controls the morphology
of MnO2/CDs nanocomposite and also acted as a reducing agent to convert potassium permanganate (KMnO4) to MnO2. Subsequently, nanoflowers, quasi-spherical particles, broken, and interconnected chain type of morphology was observed by adding dispersion of 0.5,
1.0, 1.5, and 2.0 ml CDs in acetone to 1 mmol KMnO4 aqueous solution in the corresponding MnO2/CDs-0.5, MnO2/CDs-1.0, MnO2/CDs-1.5, and MnO2/CDs-2.0 composites, respectively. A plausible mechanism on the transformation of morphology of
MnO2/CDs with CDs concentration is also provided. Further, the present work also focused for the first time on the application in the electromagnetic interference (EMI) shielding of MnO2/CD nanocomposites due to the high dielectric and conductivity. Interestingly, MnO2/CDs-2.0
(nanochains) exhibited the highest total EMI shielding efficiency (SET) of ~39.4 dB following reflection as dominant shielding mechanism due to the high aspect ratio, highest conductivity, high dielectric loss, and impendence mismatch.
The structural design of thin films is attracting attention in academia and industry in attempts to improve electromagnetic interference shielding effectiveness (EMI SE). In this study, MXene/chitosan/silver nanowire (AgNW) sandwich films, in which the AgNW core layer was bordered by two MXene/chitosan layers, were fabricated by vacuum-assisted filtration. Because of the interconnected AgNWs in the core layer and the aligned MXene sheets in the MXene/chitosan layers, the electrical conductivity of the sandwich film reached 11,459.1 S/m. Consequently, the sandwich film exhibited an SE value of 82.3 dB. What is more, when both the AgNW and MXene contents were 33.3%, the sandwich film’s EMI SE divided by its thickness was 26,167 dB/cm, which was much superior to the values reported for inorganic hybrid composites and polymer composites filled with hybrid fillers. Such a simple approach was proved to be an effective way for further structure design of thin films in EMI shielding field.
Electromagnetic shielding performance has been achieved for a polyimide (PI)-matrix composite by the strategy of self-metallization of its thermosetting PI matrix. Self-metallization of the thermosetting PI was realized by silver ion/poly(amic acid) (PAA) precursor ion exchange and thermal reduction. The factors influencing the self-metallization were investigated. The electrical conductivity and integrity for the surface of the PI were achieved by optimization of ion exchange/thermal reduction parameters. The fabricated PI-matrix composite exhibits a maximum electromagnetic interference shielding effectiveness value of 81 dB. Importantly, the electromagnetic shielding performance can be maintained even after heat condition of 300°C. Meanwhile, the surface-metallized PI composite exhibits mechanical property equivalent to the pristine composite, and an Ag/matrix interfacial strength higher than 19.6 MPa. Besides, self-metallization mechanism of the thermosetting PI was investigated.