The Impact of a Paraelectric layer in the FE/DE Stack on Performance of NCFET

<div>In this letter, through TCAD simulations, we show that the introduction of a thin paraelectric (PE) layer between the ferroelectric (FE) and dielectric (DE) layers in an MFIS structure, expands the design space for the FE layer enabling hysteresis-free and steep subthreshold behavior, even with a thicker FE layer. This can be explained by analyzing the FE-PE stack from a capacitance perspective where the thickness of the PE layer in the FE-PE stack has the effect of reducing the FE layer thickness, while also reducing the remnant polarization. Finally, for the same FE-PE-DE stack, analog performance parameters such as $\frac{g_{m}} g_{ds}}$ and $\frac{g_{m}}{I_{d}}$ are analyzed, showing good characteristics over a wide range of gate lengths, at low drain voltages, thus demonstrating applicability for low power applications.</div>

The Impact of a Paraelectric layer in the FE/DE Stack on Performance of NCFET

<div>In this letter, through TCAD simulations, we show that the introduction of a thin paraelectric (PE) layer between the ferroelectric (FE) and dielectric (DE) layers in an MFIS structure, expands the design space for the FE layer enabling hysteresis-free and steep subthreshold behavior, even with a thicker FE layer. This can be explained by analyzing the FE-PE stack from a capacitance perspective where the thickness of the PE layer in the FE-PE stack has the effect of reducing the FE layer thickness, while also reducing the remnant polarization. Finally, for the same FE-PE-DE stack, analog performance parameters such as $\frac{g_{m}} g_{ds}}$ and $\frac{g_{m}}{I_{d}}$ are analyzed, showing good characteristics over a wide range of gate lengths, at low drain voltages, thus demonstrating applicability for low power applications.</div>

Comprehensive investigation on RF/analog parameters in ferroelectric tunnel FET

In this paper, the effect of ferroelectric layer thickness (tFE), coercive field (Ec), remnant polarization (Pr), and saturation polarization (Ps) on transfer characteristic is highlighted for a Ferroelectric Tunnel FET (Fe-TFET) through a commercial TCAD simulator. Further, we have reported the RF/analog parameters like transconductance (gm), output conductance (gd), gain (gm/gd), gate capacitance (Cgg), and cut off frequency (ft) for wide range of FE parameters in Fe-TFET. Improved RF/analog performance and transfer characteristic are obtained for low value of tFE, Pr, Ec, whereas, these behavior is degraded at high value of Ps.

Reliability analysis of cost-efficient CH3NH3PbI3 based dopingless tunnel FET

Electrostatically-doped TFETs (ED-TFETs) are amongst the most widely used cost-efficient steeper devices due to the use of charge-plasma technique and tunneling mechanism. However, the reliability analysis of ED-TFETs has considered as an important concern for the research community. Also, most studies have only focused on improving the performance of ED-TFETs such as dopingless (DL)-TFET in terms of on-current (ION), subthreshold swing (SS) and threshold voltage (Vth) rather than investigating the reliability issues. In this context, the aim of our work is to investigate the reliability analysis of our previously reported methyl-ammonium lead tri-iodide materials based DL-TFET (MAPbI3-DL-TFET). The influence of interface trap charges, shallow and deep defects on the electrical and analog performance of MAPbI3-DL-TFET has been analyzed using Silvaco ATLAS tool at room temperature. Extensive results carried out show that deep-level (Gaussian) defects impact the performance of the device prominently while the tail defects affect the device performance insignificantly. The present findings showed that the donor/acceptor effect the device in subthreshold regime considerably, while in superthreshold regime the impact of trap charges is marginal. In our view, these result emphasizes the reliability analysis of MAPbI3-DL-TFET for the very first time. We hope that our research will be useful and valuable for DL-TFET manufacturers.