The Effect of Reinforcement Preheating Temperatures on Tribological Behavior of Advanced Quranic Metal-Matrix Composites (QMMC)

The growing applications of iron/copper bimetallic composites in various industries are increasing. The relationship between the properties of these materials and manufacturing parameters should be well understood. This paper represents an experimental study to evaluate the effect of reinforcement (steel rod) preheating temperature on the mechanical properties (bond strength, microhardness, and wear resistance) of copper matrix composites (QMMC). In preparing the QMMC samples, the melted copper was poured on a steel rod that had been preheated to various temperatures, namely, room temperature, 600 °C, 800 °C, and 1200 °C. Properties of the QMMC (interface microstructure, interfacial bonding strength, microhardness, and wear) were investigated. The experimental results revealed that the best bond between the copper matrix and steel rod formed only in the composites prepared by preheating the steel rods with temperatures lower than the recrystallization temperature of steel (723 °C). This is because the oxide layer and shrinkage voids (due to the difference in shrinkage between the two metals) at the interface hinder atom diffusion and bond formation at higher temperatures. The microhardness test showed that preheating steel rod to 600 °C gives the highest value among all the samples. Furthermore, the QMMC’s wear behavior confirmed that the optimization of preheating temperature is 600 °C.

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method

The interfacial mechanics and electrical properties of SiC reinforced copper matrix composites were studied via the first principles method. The work of adhesion (Wad) and the interfacial energies were calculated to evaluate the stabilities of the SiC/Cu interfacial models. The carbon terminated (CT)-SiC/Cu interfaces were predicted to be more stable than those of the silicon terminated (ST)-SiC/Cu from the results of the Wad and interfacial energies. The interfacial electron properties of SiC/Cu were studied via charge density distribution, charge density difference, electron localized functions and partial density of the state. Covalent C-Cu bonds were formed based on the results of electron properties, which further explained the fact that the interfaces of the CT-SiC/Cu are more stable than those of the ST-SiC/Cu. The interfacial mechanics of the SiC/Cu were investigated via the interfacial fracture toughness and ultimate tensile stress, and the results indicate that both CT- and ST-SiC/Cu interfaces are hard to fracture. The ultimate tensile stress of the CT-SiC/Cu is nearly 23 GPa, which is smaller than those of the ST-SiC/Cu of 25 GPa. The strains corresponding to their ultimate tensile stresses of the CT- and ST-SiC/Cu are about 0.28 and 0.26, respectively. The higher strains of CT-SiC/Cu indicate their stronger plastic properties on the interfaces of the composites.

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix studied by the First Principles Method

The interfacial mechanics and electrical properties of the SiC reinforced copper matrix composites were studied via the first principles method. The work of adhesion (Wad) and the interfacial energies were calculated to evaluate the stabilities of the SiC/Cu interfacial models. The carbon terminated (CT)-SiC/Cu interfaces were predicted more stable than those of the silicon terminated (ST)-SiC/Cu from the results of the Wad and interfacial energies. The interfacial electron properties of SiC/Cu were studied via the charge density distribution, charge density difference, electron localized functions and partial density of the state. The covalent C-Cu bonds were formed based on the results of the electron properties, which further explained the fact that the interfaces of the CT-SiC/Cu are stable than those of the ST-SiC/Cu. The interfacial mechanics of the SiC/Cu were investigated via the interfacial fracture toughness and ultimate tensile stress, and the results indicate that both CT- and ST-SiC/Cu interfaces are hard to fracture. The ultimate tensile stress of the CT-SiC/Cu is nearly 23GPa, which is smaller than those of the ST-SiC/Cu of 25 GPa. The strains corresponding to their ultimate tensile stresses of the CT- and ST-SiC/Cu are about 0.28 and 0.26, respectively. The higher strains of CT-SiC/Cu indicate their stronger plastic properties on the interfaces of the composites.

Preparation and thermophysical properties of graphite flake-carbon fiber coreinforced copper matrix composites

Graphite flake-carbon fiber coreinforced copper matrix composites were prepared by vacuum hot pressing technology. The carbon fibers were dispersed ultrasonic in alcohol and then mixed with graphite flake and alloys powder（Zr and Cu）for hot pressing sintering. The effects of the carbon fiber content on the microstructure, bending strength and thermal conductivity of the composites were investigated. The results show that the interface of the composites is well bonded. When the volume fraction of carbon fiber is 1%-3%, the carbon fiber can be uniformly dispersed in the matrix, and the bending strength of the composites can be improved effectively. When the volume fraction of carbon fiber is 2%, the bending strength reaches a maximum of 152 MPa, which is an increase of 60% compared with that of the composites without carbon fiber. However, an excessive addition of carbon fiber (4% or more) leads to an uneven distribution of carbon fiber, and the bending strength of the composites decreases. When the volume fraction of carbon fiber is 2%, the thermal conductivity of the composite is 597 W·m-1·K-1. The acoustic mismatch model (AMM) associated with the Digimat MF module is able to predict the thermal conductivity of the anisotropic multiphase composites.