scholarly journals Mechanical and Thermal Behavior of Hybrid Composite Medium Density Fiberboard reinforced with Phenol Formaldehyde

Heliyon ◽  
2021 ◽  
pp. e08597
Author(s):  
N. Pugazhenthi ◽  
P. Anand
Keyword(s):  
Thermal Behavior ◽  
Hybrid Composite ◽  
Phenol Formaldehyde ◽  
Medium Density Fiberboard ◽  
Composite Medium ◽  
Medium Density

Effect of Incorporation of Flame Retardants on Some of the Properties of Phenol Formaldehyde Medium Density Fiberboard

2008 ◽  
Vol 3 (5) ◽  
pp. 331-339 ◽  
Author(s):  
O. Sulaiman ◽  
R. Hashim ◽  
R.N. Kumar ◽  
P. Tamyez ◽  
R.J. Murphy ◽  
...  
Keyword(s):  
Flame Retardants ◽  
Phenol Formaldehyde ◽  
Medium Density Fiberboard ◽  
Medium Density

Monitoring Resin Cure Of Medium Density Fiberboard Using Dielectric Sensors

1996 ◽  
Vol 430 ◽  
Author(s):  
R. J. King ◽  
R. W. Rice
Keyword(s):  
Dielectric Constant ◽  
Real Time ◽  
Wood Density ◽  
Complex Permittivity ◽  
Loss Factor ◽  
Phenol Formaldehyde ◽  
Medium Density Fiberboard ◽  
Modulus Of Rupture ◽  
Curing Process ◽  
Medium Density

AbstractFlush mounted, in-press microwave (600–800 MHz) sensors have been developed for monitoring the complex permittivity in real time during the cure of medium density fiberboard. The measured dielectric constant (ε')a nd loss factor (ε") are independent diagnostic indicators of dynamic cure events that are catalyzed by heat, pressure and moisture. In particular, with this technique the instantaneous effects of resin viscosity, rate and degree of adhesive cure, the wood density, the changes in phase of the moisture and the rate of moisture depletion can be monitored during the entire curing process.The comparative roles of moisture and adhesive content are discussed, along with the comparative modulus of rupture with cure duration. Results are presented comparing the dynamics of phenol-formaldehyde and isocyanate resins.

scholarly journals Calcium carbonate modified urea–formaldehyde resin adhesive for strength enhanced medium density fiberboard production

RSC Advances ◽  
2021 ◽  
Vol 11 (40) ◽  
pp. 25010-25017
Author(s):  
Li Lu ◽  
Yan Wang ◽  
Tianhua Li ◽  
Supeng Wang ◽  
Shoulu Yang ◽  
...  
Keyword(s):  
Calcium Carbonate ◽  
Urea Formaldehyde ◽  
Medium Density Fiberboard ◽  
Urea Formaldehyde Resin ◽  
Formaldehyde Resin ◽  
Medium Density ◽  
Ionic Bond ◽  
Resin Adhesive ◽  
Uf Resin ◽  
Modified Urea

Reactions between CaCO3 and CH2O2 during polycondensation of UF resin produce Ca2+. Ionic bond complexation binds Ca2+ with UF resin. The UF resin crystalline percentage decreases from 26.86% to 22.71%. IB strength of resin bonded fiberboard increases from 0.75 to 0.94 MPa.

Effect of species and grinding disc distance on the surface roughness parameters of medium density fiberboard

2016 ◽  
Vol 75 (3) ◽  
pp. 335-346 ◽  
Author(s):  
Lidia Gurau ◽  
Nadir Ayrilmis ◽  
Jan Thore Benthien ◽  
Martin Ohlmeyer ◽  
Manja Kitek Kuzman ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Medium Density Fiberboard ◽  
Medium Density ◽  
Roughness Parameters ◽  
Surface Roughness Parameters
Sign in / Sign up

Export Citation Format

Share Document