scholarly journals Minimize the potential failures in the wire rod production process using six sigma and multi attribute failure mode analysis method

2020 ◽  
Vol 909 ◽  
pp. 012058
Author(s):  
Maria Ulfah ◽  
Ratna Ekawati ◽  
Nafila Amalia
Keyword(s):  
Production Process ◽  
Failure Mode ◽  
Six Sigma ◽  
Mode Analysis ◽  
Analysis Method ◽  
Wire Rod ◽  
Failure Mode Analysis ◽  
The Wire

A Correlation Model Based Failure Mode Analysis Method for Mechatronics Systems

2015 ◽  
Vol 727-728 ◽  
pp. 637-640
Author(s):  
Ying Liu ◽  
Zheng Hu ◽  
Shi Gang Zhang
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Cognitive Map ◽  
Fuzzy Cognitive Map ◽  
Mode Analysis ◽  
Correlation Model ◽  
Analysis Method ◽  
Failure Mode Analysis ◽  
The Relationship ◽  
Reasoning Technique

Failure mode analysis formechatronics systems has many problems in real applications in terms of excessivedependency on experience, lack of uniform description and tedious analysis work. In order to increaseits effectiveness, an automatic failure modes analysis framework is constructedand an extended fuzzy cognitive map is used as a reasoning technique toanalysis the effect of the failures. A function-failure correlation model witha standard description is adopted to describe the relationship between failuremodes and functions, so that designers and engineers from different fields cancomprehend and communicate within the same framework. Functional flows andfailure modes are defined as basic concepts in the fuzzy cognitive map, whichprovides an easy way to carry out an automatic cause and effect reasoning.

Case Study and Fault Modeling for Wrong Redundancy Evaluation on DRAM Devices

2007 ◽  
Author(s):  
Martin Versen ◽  
Dorina Diaconescu ◽  
Jerome Touzel
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Fault Modeling ◽  
Mode Analysis ◽  
Root Cause ◽  
Failure Mode Analysis

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.

Shear Bond Strength of Different Adhesive Systems to Primary Dentin and Enamel

2007 ◽  
Vol 31 (1) ◽  
pp. 35-40 ◽  
Author(s):  
Carla Miranda ◽  
Luiz Henrique Maykot Prates ◽  
Ricardo de Souza Vieira ◽  
Maria Cristina Marino Calvo
Keyword(s):  
Bond Strength ◽  
Failure Mode ◽  
Shear Bond Strength ◽  
Adhesive System ◽  
Mode Analysis ◽  
Single Bond ◽  
Adhesive Systems ◽  
Mean Values ◽  
Failure Mode Analysis ◽  
Distal Direction

The aims of this study were to evaluate the shear bond strength (SBS) of four adhesive systems applied to primary dentin and enamel and verify, after SBS testing, the failure mode of the adhesive interface. Sixty extracted sound primary molars were selected and crowns were sectioned in a mesial-distal direction. Specimens were randomly assigned into two groups (adhesion to enamel and adhesion to dentin) and then subdivided into four subgroups according to the adhesive system (n=15): Scotchbond Multi-Purpose (SMP) – Single Bond (SB) – Clearfil SE Bond (and Adper Prompt LPop (APL) – SBS tests were performed and the obtained values were statistically analyzed using ANOVA and Tukey tests (p<0.05). The failure mode analysis was performed with a Scanning Electron Microscope (XL-30, Philips). SBS mean values on enamel were [MPa (SD)]: SMP – 27.89 (7.49); SB – 23.92 (8.8); CSB – 24.36 (6.69); APL – 25.96 (4.08); and on dentin: SMP – 17.29 (4.25); SB – 18.2 (8.74); CSB – 16.13 (7.14); APL – 6.04 (3.35). The predominant failure mode was cohesive (primarily of the bonding agent). On enamel SBS was statistically similar for all four adhesives. On dentin SBS of APL was lower than the other tested adhesives.

Sign in / Sign up

Export Citation Format

Share Document