Ultrafast laser processing of transparent materials supported by in-situ diagnostics

For the development of industrial NIR ultrafast laser processing of transparent materials, the absorption inside the bulk material has to be controlled. Applications we aim for are front and rear side ablation, drilling and inscription of modifications for cleaving and selective laser etching of glass and sapphire in sheet geometry. We applied pump probe technology and in situ stress birefringence microscopy for fundamental studies on the influence of energy and duration (100 fs – 20 ps), temporal and spatial spacing, focusing and beam shaping of the laser pulses. Applying pump probe technique we are able to visualize differences of spatio-temporal build up of absorption, self focusing, shock wave generation for standard, multispot and beam shaped focusing. Incubation effects and disturbance of beam propagation due to modifications or ablation can be observed. In-situ imaging of stress birefringence gained insight in transient build up of stress with and without translation. The results achieved so far, demonstrate that transient stress has to be taken into account in scaling the laser machining throughput of brittle materials. Furthermore it points out that transient stress birefringence is a good indicator for accumulation effects, supporting tailored processing strategies.Cutting results achieved for selective laser etching by single pass laser modification exemplifies the benefits of process development supported by in situ diagnostics.

Progress and Perspectives in Designing Flexible Microsupercapacitors

Miniaturized flexible microsupercapacitors (MSCs) that can be integrated into self-powered sensing systems, detecting networks, and implantable devices have shown great potential to perfect the stand-alone functional units owing to the robust security, continuously improved energy density, inherence high power density, and long service life. This review summarizes the recent progress made in the development of flexible MSCs and their application in integrated wearable electronics. To meet requirements for the scalable fabrication, minimization design, and easy integration of the flexible MSC, the typical assembled technologies consist of ink printing, photolithography, screen printing, laser etching, etc., are provided. Then the guidelines regarding the electrochemical performance improvement of the flexible MSC by materials design, devices construction, and electrolyte optimization are considered. The integrated prototypes of flexible MSC-powered systems, such as self-driven photodetection systems, wearable sweat monitoring units are also discussed. Finally, the future challenges and perspectives of flexible MSC are envisioned.

Research on Trimming Frequency-Increasing Technology for Quartz Crystal Resonator Using Laser Etching

A quartz crystal resonator (QCR) is an indispensable electronic component in the field of the modern electronics industry. By designing and depositing electrodes of different shapes and thicknesses on a quartz wafer with a certain fundamental frequency, the desired target frequency can be obtained. Affected by factors such as the deposition equipment, mask, wafer size and placement position, it is difficult to accurately obtain the target frequency at a given time, especially for mass-produced QCRs. In this work, a laser with a wavelength of 532 nm was used to thin the electrodes of a QCR with a fundamental frequency of 10 MHz. The electrode surface was etched through a preset processing pattern to form a processing method of local thinning of the electrode surface. At the same time, the effect of laser etching on silicon dioxide and resonator performance was analyzed. Satisfactory trimming frequency-increasing results were achieved, such as a frequency modulation accuracy of 1 ppm, frequency distribution with good consistency and equivalent parameters with small changes, by the laser partial etching of the resonator electrode. However, when the surface electrode was etched into using through-holes, the attenuation amplitude of the equivalent parameter became larger, especially in terms of the quality factor (Q), which decreased from 63 K to 1 K, and some resonators which had a serious frequency drift of >40%. In this case, a certain number of QCRs were no longer excited to vibrate, which was due to the disappearance of the piezoelectric effect caused by the local thermal phase change in the quartz wafer.

Effect of Er:YAG Laser and Reduced Time of Acid Etching on Bond Strength of Self-adhesive Resin Cement to MTA and Biodentine

Introduction: Considering the recent trend to use mineral trioxide aggregate (MTA) and Biodentine and resin cements, more conservative approaches concurrent with adequate bond strength have always been requested. The present study aimed to evaluate the effect of pretreatment with Er:YAG laser etching versus acid-etching for 5 and 15 seconds on the micro shear bond strength of self-adhesive resin cement (SRC) to MTA and Biodentine. Materials and Methods: Forty-eight samples of each cement (MTA and Biodentine) were prepared and distributed into four groups based on surface pretreatment: 1) control, no treatment; 2) Er:YAG laser etching with energy of 60 mJ; 3) 5-second acid-etching; 4) 15-second acid-etching. All specimens were cemented using SRC. Microshear bond strengths were tested following 24-hour water storage. Debonded specimens were examined and surface topography was assessed using an atomic force machine (AFM). Data analysis was performed using the two-way ANOVA and Tukey multiple comparisons test. Results: The three testing groups of laser etch and 5-s and 15-s acid-etch demonstrated a significantly higher SBS than the control group (P<0.05) with negligible differences among them (P > 0.05). Furthermore, Biodentine showed better adhesive bonding than MTA in all groups. Conclusion: Laser etching of 60 mJ and 5-s acid-etching were as beneficial as 15-s acid-etching in terms of bond strength of SRC to MTA and Bodentine.