microstrip line
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Materials ◽  
2021 ◽  
Vol 15 (1) ◽  
pp. 291
Author(s):  
Michal Herbko ◽  
Przemyslaw Lopato

Strain is a crucial assessment parameter in structural health monitoring systems. Microstrip sensors have been one of the new types of sensors used to measure this parameter in recent years. So far, the strain directionality of these sensors and the methods of miniaturization have been studied. This article proposes the use of a single cell metamaterial as a resonator of the microstrip sensor excited through the microstrip line. The proposed solution allowed for significant miniaturization of the microstrip sensor, with just a slight decrease in sensitivity. The proposed sensor can be used to measure local deformation values and in places with a small access area. The presented sensor was validated using numerical and experimental methods. In addition, it was compared with a reference (rectangular geometry) microstrip sensor.


Author(s):  
Navneet Singh ◽  
◽  
Dr. Amit Jain ◽  
Dr. Dinesh Kumar Singh ◽  
◽  
...  

In this paper, a rectangular patch antenna is presented loaded with T-shaped notch as well as having truncated corner for the enhancement of gain and bandwidth which is bring into play for mid band of 5G applications. With design frequency of 3 GHz, this prototyped design antenna having 50 Ω microstrip line feed for impedance matching and simulation has been performed using IE3D Mentor Graphics simulation software. Fractional impedance 51.3% has been observed from 2.39 to 4.04 GHz. An enhanced peak gain of 5.05 dBi and maximum directivity of 6.214 dBi has been observed at 4.22 GHz and 4.34 GHz respectively.


2021 ◽  
Vol 22 (1) ◽  
pp. 84-91
Author(s):  
Roman S. Surovtsev ◽  
◽  
Alexander V. Nosov ◽  
Talgat R. Gazizov ◽  
◽  
...  

Author(s):  
Т.М. Ишкаев ◽  
А.Р. Насыбуллин ◽  
Р.В. Фархутдинов ◽  
Р.Р. Самигуллин

В данной статье отражаются основные результаты компьютерного моделирования, практической реализации и применения непланарной микрополосковой периодической СВЧ структуры в качестве преобразовательного элемента в задачах контроля диэлектрических параметров материалов и веществ. Основными достоинствами подобной реализации датчика являются большая чувствительность и относительно небольшие линейные размеры по сравнению с аналогичными, реализованными на основе планарных СВЧ структур. Помимо этого, благодаря непланарной форме микрополосковой линии расширяется диапазон областей применения СВЧ датчиков. This article reflects the main results of computer modeling, practical implementation and application of a nonplanar microstrip periodic microwave structure as transducer in the problems of gauging the dielectric parameters of materials and substances. The main advantages of such a sensor implementation are high sensitivity and relatively small linear dimensions in comparison with similar ones based on planar microwave structures. In addition, due to the nonplanar shape of the microstrip line, the range of applications for microwave sensors is expanded.


Author(s):  
Kanta Mori ◽  
Taichi Goto ◽  
Toshiaki Watanabe ◽  
Takumi Koguchi ◽  
Yuichi Nakamura ◽  
...  

Abstract Strong- and broadband-spin-wave (SW) excitation/detection structures are useful for magnonic devices. In particular, such structures are essential for observing magnonic bandgaps of magnonic crystals (MCs). Therefore, this study proposes a manufacturable broadband-SW excitation/detection antenna structure suitable for evaluating MCs. The antenna structure comprises a microstrip line fabricated on a yttrium iron garnet on a metal-covered silicon substrate. Calculations were performed using a three-dimensional finite integration technique and dispersion curves of SWs. The proposed structure exhibited high performance because of the significantly short distance between the signal line and ground plane. The generated bandwidth was ~1.69 GHz for the 8.9-μm-wavelength SW at a frequency of 4 GHz. This work proposed an appropriate antenna structure for observing magnonic bandgaps, showing high potential for the development of MCs in integrated SW devices.


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