Maximizing ATPG Diagnosis Resolution on Unique Single Failing Devices

Unique single failing device is common for customer returns and reliability failures. When the initial and iterative Automatic Test Pattern Generator (ATPG) could not provide a sufficient diagnostic resolution, it can become quite challenging for the analyst to determine the failure mechanism in an efficient and effective way. Fault isolation could be performed in combination with the diagnosis results but there are cases with mismatch between the results (location, fault type, suspect nets). When the diagnostic resolution is low, the probability for such mismatches are high. This paper proposes an approach to increase the diagnostic resolution by utilizing a high-resolution targeted pattern (HRT) and single shot logic (SSL) patterns. Two cases will be discussed in the paper to highlight this approach and show in detail how it was utilized on actual failing units.

Customers' perceptions of returning items purchased online: planned versus unplanned product returners

PurposeThe purpose of this study is to address two issues relevant to those managing product returns: (1) how customers perceive the returning process and assessing the extent that these perceptions have on satisfaction with the organization, loyalty and word-of-mouth (WOM) and (2) are these outcomes moderated by whether customer returns were planned or unplanned?Design/methodology/approachThe data consisted of 21 semi-structured interviews (pilot study) and a quantitative survey (n = 384; main study) targeted at consumers who had bought fashion items online.FindingsQualitative insights revealed that perceptions of the returning experience are driven by monetary costs, convenience, stress and guilt. Quantitative findings showed that the returning experience explains return satisfaction for both planned and unplanned returners, and returning satisfaction explains overall satisfaction and WOM. The noteworthy difference concerns loyalty: although customers that planned to return items are more loyal to the organization, it is the unplanned returners whose loyalty can be significantly increased by better managing the returning process.Practical implicationsReturning products online is increasingly common and thus forms an important part of the customer's overall experience with an organization. Returns management can therefore drive key customer outcomes. Understanding the dynamics between the product return experience, return satisfaction and customer outcomes will help practitioners design and implement more informed returns management strategies. Measures are also presented that assess the cognitive and emotional aspects associated with returning products.Social implicationsReturning products is an increasingly important challenge for online retailers. Understanding what kinds of returning behaviors occur allows companies to design and execute better informed decisions to manage this phenomenon, not only for the sake of firm performance but also for societal and environmental benefits – the triple bottom line.Originality/valueWhile scholars have investigated the relationship between return policies (e.g. free vs fee) and profitability, no prior literature has examined the returning experience: how consumers perceive the returning process; motivations for their returns (whether returns were planned or not) and subsequent customer outcomes.

Application of B-Scan SAT Mode, an Acoustic Cross Section Technique to Analyze Packaged Components beyond Delamination

Failure Analysis labs involved in customer returns always face a greater challenge, demand from customer for a faster turnaround time to identify the root cause of the failure. Unfortunately, root cause identification in failure analysis is often performed incompletely or rushing into destructive techniques, leading to poor understanding of the failure mechanism and root-cause, customer dissatisfaction. Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM) has been adopted by several Failure Analysis labs because it provides reliable non-destructive imaging of package cracks and delamination. The SAM is a vital tool in the effort to analyze molded packages. This paper provides a review of non-destructive testing method used to evaluate Integrated Circuit (IC) package. The case studies discussed in this paper identifies different types of defects and the capabilities of B-Scan (cross-sectional tomography) method employed for defect detection beyond delamination.