Tribocorrosion Investigations of Cu/Ru Interconnect Structure During CMP

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_4 ◽

2017 ◽

pp. 75-89

Author(s):

Jie Cheng

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