Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses
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Galvanic Corrosion Inhibitors for Cu/Ru Couple During Chemical Mechanical Polishing of Ru

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_6 ◽

2017 ◽

pp. 107-119 ◽

Author(s):

Jie Cheng

Keyword(s):

Chemical Mechanical Polishing ◽

Corrosion Inhibitors ◽

Galvanic Corrosion ◽

Mechanical Polishing

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Synergetic Effect of Potassium Molybdate and Benzotriazole on the CMP of Ru and Cu in KIO4-Based Slurry

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_7 ◽

2017 ◽

pp. 121-134

Author(s):

Jie Cheng

Keyword(s):

Synergetic Effect

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Conclusions and Recommendations

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_8 ◽

2017 ◽

pp. 135-137

Author(s):

Jie Cheng

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Micro-galvanic Corrosion of Cu/Ru Couple in KIO4 Solution

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_5 ◽

2017 ◽

pp. 91-105

Author(s):

Jie Cheng

Keyword(s):

Galvanic Corrosion

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Tribocorrosion Investigations of Cu/Ru Interconnect Structure During CMP

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_4 ◽

2017 ◽

pp. 75-89

Author(s):

Jie Cheng

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Material Removal Mechanism of Ru in KIO4-Based Slurry

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_3 ◽

2017 ◽

pp. 49-73

Author(s):

Jie Cheng

Keyword(s):

Material Removal ◽

Removal Mechanism ◽

Material Removal Mechanism

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Introduction

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_1 ◽

2017 ◽

pp. 1-27

Author(s):

Jie Cheng

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Material Removal Mechanism of Cu in KIO4-Based Slurry

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect - Springer Theses ◽

10.1007/978-981-10-6165-3_2 ◽

2017 ◽

pp. 29-48

Author(s):

Jie Cheng

Keyword(s):

Material Removal ◽

Removal Mechanism ◽

Material Removal Mechanism

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