Development of ultra-thinning technology for logic and memory heterogeneous stack applications

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6262991 ◽

2012 ◽

Author(s):

N. Maeda ◽

Y. S. Kim ◽

Y. Hikosaka ◽

T. Eshita ◽

H. Kitada ◽

...

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