2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International
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109

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8

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9781467321907, 9781467321891, 9781467321884

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Preface

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6263050 ◽

2012 ◽

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Advances of 3M™ wafer support system

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6262994 ◽

2012 ◽

Author(s):

Kazuta Saito ◽

Richard J. Webb ◽

Blake R. Dronen

Keyword(s):

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A 3D heterogeneous integration method using LTCC wafer for RF applications

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6262955 ◽

2012 ◽

Author(s):

Xiaoyu Mi ◽

O. Toyoda ◽

S. Ueda ◽

F. Nakazawa

Keyword(s):

Integration Method ◽

Heterogeneous Integration ◽

Rf Applications

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Evolutional Directions of Smart Automotive Systems and Semiconductors

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6262980 ◽

2012 ◽

Author(s):

Hideaki Ishihara

Keyword(s):

Automotive Systems

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A 3D-Integration method to compensate output voltage degradation of boost converter for compact Solid-State-Drives

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6263023 ◽

2012 ◽

Author(s):

Teruyoshi Hatanaka ◽

Koh Johguchi ◽

Ken Takeuchi

Keyword(s):

Solid State ◽

Output Voltage ◽

Integration Method ◽

Boost Converter ◽

Solid State Drives ◽

3D Integration ◽

Voltage Degradation

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Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6263002 ◽

2012 ◽

Author(s):

Sayuri Kohara ◽

Akihiro Horibe ◽

Kuniaki Sueoka ◽

Keiji Matsumoto ◽

Fumiaki Yamada ◽

...

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

3D Integration ◽

Thermal Stress Analysis ◽

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Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6263016 ◽

2012 ◽

Author(s):

Won-Myoung Ki ◽

Myong-Suk Kang ◽

Sehoon Yoo ◽

Chang-Woo Lee

Keyword(s):

Bonding Process ◽

Cu Pillar ◽

Cu Pillar Bump ◽

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A middle-grain circuit partitioning strategy for 3-D integrated floating-point multipliers

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6263031 ◽

2012 ◽

Author(s):

Jubee Tada ◽

Ryusuke Egawa ◽

Kazushige Kawai ◽

Hiroaki Kobayashi ◽

Gensuke Goto

Keyword(s):

Floating Point ◽

Circuit Partitioning ◽

Partitioning Strategy

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Design exploration of 3D stacked non-volatile memory by conductive bridge based crossbar

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6263047 ◽

2012 ◽

Author(s):

Yuhao Wang ◽

Chun Zhang ◽

Revanth Nadipalli ◽

Hao Yu ◽

Roshan Weerasekera

Keyword(s):

Design Exploration ◽

Non Volatile Memory ◽

Conductive Bridge ◽

Volatile Memory

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Development of ultra-thinning technology for logic and memory heterogeneous stack applications

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6262991 ◽

2012 ◽

Author(s):

N. Maeda ◽

Y. S. Kim ◽

Y. Hikosaka ◽

T. Eshita ◽

H. Kitada ◽

...

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