Design technique of broadband planar interconnects for co-layer multi-chip module (MCM) of microwave and millimeter-wave circuits

Author(s):  
J.B. Tang ◽  
K. Wu
1987 ◽  
pp. 108-113 ◽  
Author(s):  
J. Buechler ◽  
E. Kasper ◽  
P. Russer ◽  
K. M. Strohm

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