Process induced Wafer Geometry impact on center and edge lithography performance for sub 2X nm nodes

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164417 ◽

2015 ◽

Author(s):

Stephen Tran ◽

Wei Yeeng Ng ◽

Michael Johnson ◽

Dave Kewley ◽

Venky Subramony ◽

...

Download Full-text