2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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93

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5

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Published By IEEE

9781479999309

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Yield improvement in dense EEPROM by bit mapping and experimental design

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164478 ◽

2015 ◽

Author(s):

Moshe Agam ◽

Santosh Menon ◽

Peter Cosmin

Keyword(s):

Experimental Design ◽

Yield Improvement ◽

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Particle free handling of substrates

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164421 ◽

2015 ◽

Author(s):

Hassan Samadi ◽

Markus Pfeffer ◽

Roswitha Altmann ◽

Andreas Leibold ◽

Thomas Gumprecht ◽

...

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Using fractal dimensions as performance indicators for manufacturing systems

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164493 ◽

2015 ◽

Author(s):

Gero Grau ◽

Detlef Pabst ◽

Marcel Stehli

Keyword(s):

Performance Indicators ◽

Manufacturing Systems ◽

Fractal Dimensions

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Process induced Wafer Geometry impact on center and edge lithography performance for sub 2X nm nodes

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164417 ◽

2015 ◽

Author(s):

Stephen Tran ◽

Wei Yeeng Ng ◽

Michael Johnson ◽

Dave Kewley ◽

Venky Subramony ◽

...

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Using a visible BI to construct lean manufacturing within big data

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164480 ◽

2015 ◽

Author(s):

S.H. Chiu ◽

H.K. Lin ◽

Jung Pin Hsu ◽

Che Yu Chiu

Keyword(s):

Big Data ◽

Lean Manufacturing

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Correlation of non-visual defects at post copper CMP to yield critical physical defects at next metallization layer

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164441 ◽

2015 ◽

Author(s):

M. Specht ◽

H. Franke ◽

O. Luxenhofer ◽

K. Mai ◽

W. Usry ◽

...

Keyword(s):

Metallization Layer ◽

Visual Defects ◽

Physical Defects ◽

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Segmentation of the expected duration of maintenance activities in semiconductor fabs

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164495 ◽

2015 ◽

Author(s):

Itai Regev ◽

Diamanta Benson-Karhi

Keyword(s):

Maintenance Activities ◽

Expected Duration

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Spatial risk assessment on circular domains: Application to wafer profile monitoring

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164475 ◽

2015 ◽

Author(s):

Esperan Padonou ◽

Olivier Roustant ◽

Jakey Blue ◽

Hugues Duverneuil

Keyword(s):

Risk Assessment ◽

Profile Monitoring ◽

Spatial Risk ◽

Circular Domains

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Bridging the gap - integrating APC constraints and WIP flow optimization to enhance automated decision making in semiconductor manufacturing

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164449 ◽

2015 ◽

Author(s):

Marcel Stehli ◽

Daniel Zschabitz ◽

Thomas Jahnig

Keyword(s):

Decision Making ◽

Semiconductor Manufacturing ◽

Flow Optimization ◽

Automated Decision Making

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Deep trench capacitor in three dimensional through silicon via keepout area for electrostatic discharge protection

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164433 ◽

2015 ◽

Author(s):

Nazmul Habib ◽

Mujahid Muhammad ◽

Jeanne Bickford ◽

John Safran ◽

Ahmed Y Ginawi ◽

...

Keyword(s):

Electrostatic Discharge ◽

Three Dimensional ◽

Through Silicon Via ◽

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