2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Latest Publications

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Published By IEEE

9781479999309

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Segmentation of the expected duration of maintenance activities in semiconductor fabs

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164495 ◽

2015 ◽

Cited By ~ 3

Author(s):

Itai Regev ◽

Diamanta Benson-Karhi

Keyword(s):

Maintenance Activities ◽

Expected Duration

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Spatial risk assessment on circular domains: Application to wafer profile monitoring

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164475 ◽

2015 ◽

Author(s):

Esperan Padonou ◽

Olivier Roustant ◽

Jakey Blue ◽

Hugues Duverneuil

Keyword(s):

Risk Assessment ◽

Profile Monitoring ◽

Spatial Risk ◽

Circular Domains

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Yield improvement in dense EEPROM by bit mapping and experimental design

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164478 ◽

2015 ◽

Author(s):

Moshe Agam ◽

Santosh Menon ◽

Peter Cosmin

Keyword(s):

Experimental Design ◽

Yield Improvement ◽

Bit Mapping

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Particle free handling of substrates

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164421 ◽

2015 ◽

Author(s):

Hassan Samadi ◽

Markus Pfeffer ◽

Roswitha Altmann ◽

Andreas Leibold ◽

Thomas Gumprecht ◽

...

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Using fractal dimensions as performance indicators for manufacturing systems

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164493 ◽

2015 ◽

Author(s):

Gero Grau ◽

Detlef Pabst ◽

Marcel Stehli

Keyword(s):

Performance Indicators ◽

Manufacturing Systems ◽

Fractal Dimensions

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Process induced Wafer Geometry impact on center and edge lithography performance for sub 2X nm nodes

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164417 ◽

2015 ◽

Author(s):

Stephen Tran ◽

Wei Yeeng Ng ◽

Michael Johnson ◽

Dave Kewley ◽

Venky Subramony ◽

...

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Using a visible BI to construct lean manufacturing within big data

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164480 ◽

2015 ◽

Author(s):

S.H. Chiu ◽

H.K. Lin ◽

Jung Pin Hsu ◽

Che Yu Chiu

Keyword(s):

Big Data ◽

Lean Manufacturing

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Correlation of non-visual defects at post copper CMP to yield critical physical defects at next metallization layer

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164441 ◽

2015 ◽

Cited By ~ 1

Author(s):

M. Specht ◽

H. Franke ◽

O. Luxenhofer ◽

K. Mai ◽

W. Usry ◽

...

Keyword(s):

Metallization Layer ◽

Visual Defects ◽

Physical Defects ◽

Copper Cmp

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Advanced Process Control (APC) and Real Time Dispatch (RTD) system integration for etch depth control process in 300mm Fab

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164426 ◽

2015 ◽

Cited By ~ 3

Author(s):

Gaurav K. Agrawal ◽

Soon Yoong Loh ◽

Abemelek B. Shebi

Keyword(s):

Process Control ◽

Real Time ◽

System Integration ◽

Control Process ◽

Etch Depth ◽

Advanced Process Control ◽

Depth Control

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Big data emergence in semiconductor manufacturing advanced process control

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2015.7164483 ◽

2015 ◽

Cited By ~ 6

Author(s):

James Moyne ◽

Jamini Samantaray ◽

Mike Armacost

Keyword(s):

Big Data ◽

Process Control ◽

Semiconductor Manufacturing ◽

Advanced Process Control

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2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Segmentation of the expected duration of maintenance activities in semiconductor fabs

Spatial risk assessment on circular domains: Application to wafer profile monitoring

Yield improvement in dense EEPROM by bit mapping and experimental design

Particle free handling of substrates

Using fractal dimensions as performance indicators for manufacturing systems

Process induced Wafer Geometry impact on center and edge lithography performance for sub 2X nm nodes

Using a visible BI to construct lean manufacturing within big data

Correlation of non-visual defects at post copper CMP to yield critical physical defects at next metallization layer

Advanced Process Control (APC) and Real Time Dispatch (RTD) system integration for etch depth control process in 300mm Fab

Big data emergence in semiconductor manufacturing advanced process control

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Latest Publications