A new methodology for modeling MEMS structures

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287030 ◽

2004 ◽

Author(s):

Kaiping Zeng ◽

Zhenyu Liu ◽

J.G. Korvink

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