Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003.
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SU8 resist plasma etching and its optimisation

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287050 ◽

2004 ◽

Author(s):

Guodong Hong ◽

A.S. Holmes ◽

M.E. Heaton

Keyword(s):

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Thermal and mechanical simulation of bulk resonators

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287038 ◽

2004 ◽

Author(s):

M. Morata ◽

E. Figueras ◽

I. Gracia ◽

L. Fonseca ◽

C. Cane

Keyword(s):

Mechanical Simulation

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Capacitive humidity sensor using a polyimide sensing film

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287041 ◽

2004 ◽

Author(s):

J. Laconte ◽

V. Wilmart ◽

J.-P. Raskin ◽

D. Flandre

Keyword(s):

Humidity Sensor ◽

Capacitive Humidity Sensor

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Model-based optimization of medical test strips

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287035 ◽

2004 ◽

Author(s):

O. Nussen ◽

D. Peters ◽

H. Bolte ◽

R. Laur

Keyword(s):

Medical Test ◽

Test Strips ◽

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A CMOS low noise amplifier for biomedical telemetry applications

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287015 ◽

2004 ◽

Author(s):

R.L. Moreno ◽

E.C. Rodrigues

Keyword(s):

Low Noise ◽

Low Noise Amplifier ◽

Noise Amplifier

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Evaluation of principal characteristics of circular resonator in thin film applications

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287037 ◽

2004 ◽

Author(s):

S. Myllymaki ◽

E. Ristolainen ◽

P. Heino ◽

A. Lehto ◽

K. Varjonen

Keyword(s):

Thin Film ◽

Principal Characteristics

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Soldered sealing process to assemble a protective cap for a MEMS CSP

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287047 ◽

2004 ◽

Author(s):

E. Jung ◽

A. Ostmann ◽

M. Wiemer ◽

I. Kolesnik ◽

M. Rutter

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A new methodology for modeling MEMS structures

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287030 ◽

2004 ◽

Author(s):

Kaiping Zeng ◽

Zhenyu Liu ◽

J.G. Korvink

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Design and modelling of a microsensor for atmospheric electric field measurement

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287027 ◽

2004 ◽

Author(s):

Zheng Cui ◽

Chao Gong ◽

Shanhong Xia

Keyword(s):

Electric Field ◽

Field Measurement ◽

Atmospheric Electric Field ◽

Electric Field Measurement

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Theoretical aspects concerning the calculus possibilities of magnetic fluid core coils

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287025 ◽

2004 ◽

Author(s):

N.C. Popa ◽

A. Siblini ◽

L. Jorat

Keyword(s):

Magnetic Fluid ◽

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