Soldered sealing process to assemble a protective cap for a MEMS CSP

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. ◽

10.1109/dtip.2003.1287047 ◽

2004 ◽

Author(s):

E. Jung ◽

A. Ostmann ◽

M. Wiemer ◽

I. Kolesnik ◽

M. Rutter

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