New metal board for COB, Multi-Chip Module, TAB and Phlip-Chip

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346790 ◽

2002 ◽

Author(s):

A. Okuno ◽

N. Oyama ◽

T. Hashimoto ◽

H. Kinoshita ◽

H. Shida

Download Full-text