Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)
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179

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12

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0780307941

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New metal board for COB, Multi-Chip Module, TAB and Phlip-Chip

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346790 ◽

2002 ◽

Author(s):

A. Okuno ◽

N. Oyama ◽

T. Hashimoto ◽

H. Kinoshita ◽

H. Shida

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Environmental stress screening of electronic assemblies, a thermal transient study

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346848 ◽

2002 ◽

Author(s):

N. Pasco

Keyword(s):

Environmental Stress ◽

Thermal Transient ◽

Transient Study ◽

Electronic Assemblies

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Diamond-a new high thermal conductivity substrate for multichip modules and hybrid circuits

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346743 ◽

2002 ◽

Author(s):

D. Norwood ◽

W. Worobey ◽

D. Peterson ◽

D. Miller

Keyword(s):

Thermal Conductivity ◽

High Thermal Conductivity ◽

Multichip Modules

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Designing for signal integrity in high speed systems

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346794 ◽

2002 ◽

Author(s):

L. Heid ◽

M. Degerstrom ◽

C. Nelson ◽

E. Priest ◽

G. Katopis

Keyword(s):

Signal Integrity

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Overview of via formation technologies for ceramic packaging manufacturing

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346840 ◽

2002 ◽

Author(s):

You-Wen Yau ◽

D.C. Long ◽

W.T. Grant ◽

N.S. Sandhu ◽

J.J. Fulton

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Resin and flexible metal bumps for chip-on-glass technology

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346718 ◽

2002 ◽

Author(s):

K. Matsui ◽

K. Utsumi ◽

H. Ohkubo ◽

C. Sugitani

Keyword(s):

Glass Technology ◽

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Cooperative application of holography and finite element modeling in determining critical vibration behavior of printed wiring boards

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346695 ◽

2002 ◽

Author(s):

H.D. Blair ◽

E.E.J. Jih ◽

G.M. Brown ◽

T.-Y. Pan

Keyword(s):

Finite Element ◽

Finite Element Modeling ◽

Printed Wiring Boards ◽

Element Modeling ◽

Vibration Behavior

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Active board concurrent maintenance

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346804 ◽

2002 ◽

Author(s):

S. Makow

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Mechanical and materials modeling/simulation/verification trend for electronics packaging products

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346834 ◽

2002 ◽

Author(s):

C.K. Lim

Keyword(s):

Electronics Packaging ◽

Modeling Simulation ◽

Materials Modeling

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Efficient optical fiber-to-waveguide coupling suitable for passive alignment

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) ◽

10.1109/ectc.1993.346691 ◽

2002 ◽

Author(s):

T.S. Barry ◽

M.H. Cordaro ◽

R.R. Krchnavek ◽

K. Nakagawa ◽

C.W. Phelps ◽

...

Keyword(s):

Optical Fiber ◽

Waveguide Coupling ◽

Passive Alignment

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