Ultra-thin Die Characterization for Stack-die Packaging

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373976 ◽

2007 ◽

Author(s):

Wei Sun ◽

W.H. Zhu ◽

F.X. Che ◽

C.K. Wang ◽

Anthony Y.S. Sun ◽

...

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