2007 Proceedings 57th Electronic Components and Technology Conference

Oxidation Prevention and Electrical Property Enhancements of Copper-filled Electrically Conductive Adhesives for Electronic Packaging and Interconnection

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373780 ◽

2007 ◽

Cited By ~ 1

Author(s):

Myung Jin Yim ◽

Yi Li ◽

Kyoung Sik Moon ◽

C. P. Wong

Keyword(s):

Electrical Property ◽

Electronic Packaging ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Electrochemical Biosensors and Microfluidics in Organic System-on-Package Technology

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.374001 ◽

2007 ◽

Cited By ~ 3

Author(s):

Janagama D. Goud ◽

P. Markondeya Raj ◽

Jin Liu ◽

Roger Narayan ◽

Mahadevan Iyer ◽

...

Keyword(s):

Electrochemical Biosensors ◽

Organic System

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Design and Characterisation of High-Q Solidly-Mounted Bulk Acoustic Wave Filters

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373793 ◽

2007 ◽

Cited By ~ 13

Author(s):

Remco Strijbos ◽

Andre Jansman ◽

Jan-Willem Lobeek ◽

Nancy Xin Li ◽

Nick Pulsford

Keyword(s):

Acoustic Wave ◽

Bulk Acoustic Wave ◽

High Q ◽

Wave Filters

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Ultra-thin Die Characterization for Stack-die Packaging

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373976 ◽

2007 ◽

Cited By ~ 5

Author(s):

Wei Sun ◽

W.H. Zhu ◽

F.X. Che ◽

C.K. Wang ◽

Anthony Y.S. Sun ◽

...

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‘trimoda’ Wafer-Level Package: Fully Compatible Electrical, Optical, and Fluidic Chip I/O Interconnects

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373855 ◽

2007 ◽

Cited By ~ 1

Author(s):

Muhannad S. Bakir ◽

Bing Dang ◽

Oluwafemi O. Ogunsola ◽

James D. Meindl

Keyword(s):

Wafer Level ◽

Wafer Level Package

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Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373921 ◽

2007 ◽

Cited By ~ 4

Author(s):

Isaac Robin Abothu ◽

P. Markondeya Raj ◽

Jin Hyun Hwang ◽

Manish Kumar ◽

Mahadevan Iyer ◽

...

Keyword(s):

Thin Film ◽

Ceramic Capacitors ◽

Organic Packages ◽

Electrical Reliability ◽

Processing Properties ◽

Ultra Thin Film

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Realization of Electrical-Optical-Circuit-Board Self-packaging

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373973 ◽

2007 ◽

Cited By ~ 2

Author(s):

D.K. Cai ◽

A. Neyer

Keyword(s):

Circuit Board ◽

Optical Circuit

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Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373779 ◽

2007 ◽

Cited By ~ 5

Author(s):

Rabindra N. Das ◽

Konstantinos I. Papathomas ◽

John M. Lauffer ◽

Frank D. Egitto

Keyword(s):

Melting Point ◽

Conducting Polymers ◽

Reliability Performance

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Electromigration Study in Flip Chip Solder Joints

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373986 ◽

2007 ◽

Cited By ~ 13

Author(s):

Jae-Woong Nah ◽

Kai Chen ◽

J. O. Suh ◽

K. N. Tu

Keyword(s):

Flip Chip ◽

Solder Joints

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A Novel Approach for System Level Package Modeling to Address Signal and Power Integrity Issues

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.374016 ◽

2007 ◽

Cited By ~ 3

Author(s):

X.C. Wei ◽

E.X. Liu ◽

Z.Z. Oo ◽

E.P. Li ◽

R. Vahldieck

Keyword(s):

System Level ◽

Power Integrity ◽

Novel Approach

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2007 Proceedings 57th Electronic Components and Technology Conference
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Oxidation Prevention and Electrical Property Enhancements of Copper-filled Electrically Conductive Adhesives for Electronic Packaging and Interconnection

Electrochemical Biosensors and Microfluidics in Organic System-on-Package Technology

Design and Characterisation of High-Q Solidly-Mounted Bulk Acoustic Wave Filters

Ultra-thin Die Characterization for Stack-die Packaging

‘trimoda’ Wafer-Level Package: Fully Compatible Electrical, Optical, and Fluidic Chip I/O Interconnects

Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages

Realization of Electrical-Optical-Circuit-Board Self-packaging

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections

Electromigration Study in Flip Chip Solder Joints

A Novel Approach for System Level Package Modeling to Address Signal and Power Integrity Issues

Export Citation Format

2007 Proceedings 57th Electronic Components and Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Oxidation Prevention and Electrical Property Enhancements of Copper-filled Electrically Conductive Adhesives for Electronic Packaging and Interconnection

Electrochemical Biosensors and Microfluidics in Organic System-on-Package Technology

Design and Characterisation of High-Q Solidly-Mounted Bulk Acoustic Wave Filters

Ultra-thin Die Characterization for Stack-die Packaging

‘trimoda’ Wafer-Level Package: Fully Compatible Electrical, Optical, and Fluidic Chip I/O Interconnects

Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages

Realization of Electrical-Optical-Circuit-Board Self-packaging

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections

Electromigration Study in Flip Chip Solder Joints

A Novel Approach for System Level Package Modeling to Address Signal and Power Integrity Issues

2007 Proceedings 57th Electronic Components and Technology Conference
Latest Publications