Silicon Interposer Warpage Study for 2.5D IC without TSV Utilizing Glass Carrier CTE and Passivation Thickness Tuning

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.164 ◽

2016 ◽

Author(s):

Chieh-Lung Lai ◽

Hung-Yuan Li ◽

Allen Chen ◽

Terren Lu

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