2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

397

(FIVE YEARS 0)

H-INDEX

15

(FIVE YEARS 0)

Published By IEEE

9781509012046

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.278 ◽

2016 ◽

Author(s):

Seahee Hwangbo ◽

Aric B. Shorey ◽

Yong-Kyu Yoon

Keyword(s):

Integrated Circuits ◽

Millimeter Wave ◽

Patch Antennas ◽

3D Integrated Circuits

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Advanced 3D eWLB-PoP (Embedded Wafer Level Ball Grid Array - Package on Package) Technology

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.257 ◽

2016 ◽

Author(s):

Yaojian Lin ◽

Chen Kang ◽

Linda Chua ◽

Won Kyung Choi ◽

Seung Wook Yoon

Keyword(s):

Ball Grid Array ◽

Wafer Level ◽

Ball Grid Array Package

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Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.203 ◽

2016 ◽

Author(s):

Vempati Srinivasa Rao ◽

Chai Tai Chong ◽

David Ho ◽

Ding Mian Zhi ◽

Chong Ser Choong ◽

...

Keyword(s):

Mobile Applications ◽

High Density ◽

Wafer Level ◽

Wafer Level Package

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Effective Post-TSV-DRIE Wet Clean Process for through Silicon Via Applications

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.383 ◽

2016 ◽

Author(s):

Laura Mauer ◽

Stephen Olson ◽

Victor Vartanian ◽

John Taddei ◽

John Clark ◽

...

Keyword(s):

Through Silicon Via

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Demonstration of 20 um I/O Pitch RDL Using a Novel, Ultra-Thin Dry Film Photosensitive Dielectric for Panel-Based Glass Interposers

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.302 ◽

2016 ◽

Author(s):

Atsushi Kubo ◽

Chandrasekharan Nair ◽

Ryuta Furuya ◽

Tomoyuki Ando ◽

Hao Lu ◽

...

Keyword(s):

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Solid-State Reactions of Silver and Aluminum Associated with Silver Wire Bonds

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.78 ◽

2016 ◽

Author(s):

Shao-Wei Fu ◽

Chin C. Lee

Keyword(s):

Solid State ◽

Silver Wire ◽

Solid State Reactions ◽

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A Flexible and Stretchable Resistive Epidermal Pressure Sensor for Health Monitoring

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.77 ◽

2016 ◽

Author(s):

Zhibo Chen ◽

Wei Huang ◽

Xinfeng Zhang ◽

Matthew M. F. Yuen

Keyword(s):

Health Monitoring ◽

Pressure Sensor

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Silicon Interposer Warpage Study for 2.5D IC without TSV Utilizing Glass Carrier CTE and Passivation Thickness Tuning

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.164 ◽

2016 ◽

Author(s):

Chieh-Lung Lai ◽

Hung-Yuan Li ◽

Allen Chen ◽

Terren Lu

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Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.102 ◽

2016 ◽

Author(s):

Fumihiro Inoue ◽

Anne Jourdain ◽

Joeri De Vos ◽

Erik Sleeckx ◽

Eric Beyne ◽

...

Keyword(s):

Thinning Process

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Foldable Fan-Out Wafer Level Packaging

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.90 ◽

2016 ◽

Author(s):

T. Braun ◽

K. -F. Becker ◽

S. Raatz ◽

M. Minkus ◽

V. Bader ◽

...

Keyword(s):

Wafer Level ◽

Wafer Level Packaging

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