2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

397

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781509012046

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Crosstalk-Induced Jitter Simulation Methodology for High-Density I/O Designs

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.392 ◽

2016 ◽

Author(s):

Shen Dong ◽

Hong Shi

Keyword(s):

High Density ◽

Simulation Methodology

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A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing >10-dB Gain

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.365 ◽

2016 ◽

Cited By ~ 7

Author(s):

Fuad E. Doany ◽

Russell Budd ◽

Laurent Schares ◽

Tam Huynh ◽

Michael Wood ◽

...

Keyword(s):

Semiconductor Optical Amplifier ◽

Flip Chip ◽

Optical Amplifier ◽

Silicon Photonic

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Electromigration Induced Stress in Lead-Free Solder Joints

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.371 ◽

2016 ◽

Cited By ~ 1

Author(s):

Jiamin Ni ◽

Antoinette Maniatty ◽

Yong Liu ◽

Jifa Hao ◽

Matt Ring

Keyword(s):

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Induced Stress ◽

Free Solder

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Study of Crystal Orientation and Microstructure in Sn-Bi and Sn-Ag-Cu Solder with Thermal Compression Bonding and Mass Reflow

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.140 ◽

2016 ◽

Cited By ~ 4

Author(s):

Kei Murayama ◽

Mitsuhiro Aizawa ◽

Takashi Kurihara

Keyword(s):

Crystal Orientation ◽

Thermal Compression

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Mesoporous Silica Nanoparticles: A Potential Inorganic Filler to Prepare Polymer Composites with Low CTE and Low Modulus for Electronic Packaging Applications

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.176 ◽

2016 ◽

Cited By ~ 1

Author(s):

Gang Li ◽

Pengli Zhu ◽

Tao Zhao ◽

Rong Sun ◽

Daoqiang Lu ◽

...

Keyword(s):

Mesoporous Silica ◽

Silica Nanoparticles ◽

Polymer Composites ◽

Electronic Packaging ◽

Mesoporous Silica Nanoparticles ◽

Inorganic Filler ◽

Low Modulus

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Improved Joint Strength with Sintering Bonding Using Microscale Cu Particles by an Oxidation-Reduction Process

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.248 ◽

2016 ◽

Cited By ~ 2

Author(s):

Xiangdong Liu ◽

Hiroshi Nishikawa

Keyword(s):

Joint Strength ◽

Reduction Process ◽

Oxidation Reduction

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A Novel Approach to Integrating 3D/4D Printing and Stretchable Conductive Adhesive Technologies for High Frequency Packaging Applications

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.346 ◽

2016 ◽

Author(s):

Taoran Le ◽

Chia-Chi Tuan ◽

Ryan A. Bahr ◽

C. P. Wong ◽

M. M. Tentzeris

Keyword(s):

High Frequency ◽

Conductive Adhesive ◽

4D Printing ◽

Novel Approach

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A Comparative Study of a Fan Out Packaged Product: Chip First and Chip Last

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.116 ◽

2016 ◽

Cited By ~ 14

Author(s):

Scott Chen ◽

Simon Wang ◽

John Hunt ◽

William Chen ◽

Leander Liang ◽

...

Keyword(s):

Comparative Study

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Peridynamic Direct Concentration Approach by Using ANSYS

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.251 ◽

2016 ◽

Cited By ~ 2

Author(s):

S. W. Han ◽

C. Diyaroglu ◽

S. Oterkus ◽

E. Madenci ◽

E. Oterkus ◽

...

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Improvement of a TSV Reveal Process Comprising Direct Si/Cu Grinding and Residual Metal Removal

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.381 ◽

2016 ◽

Cited By ~ 3

Author(s):

Naoya Watanabe ◽

Masahiro Aoyagi ◽

Tsubasa Bandoh ◽

Takahiko Mitsui ◽

Eiichi Yamamoto

Keyword(s):

Metal Removal

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2016 IEEE 66th Electronic Components and Technology Conference (ECTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Crosstalk-Induced Jitter Simulation Methodology for High-Density I/O Designs

A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing >10-dB Gain

Electromigration Induced Stress in Lead-Free Solder Joints

Study of Crystal Orientation and Microstructure in Sn-Bi and Sn-Ag-Cu Solder with Thermal Compression Bonding and Mass Reflow

Mesoporous Silica Nanoparticles: A Potential Inorganic Filler to Prepare Polymer Composites with Low CTE and Low Modulus for Electronic Packaging Applications

Improved Joint Strength with Sintering Bonding Using Microscale Cu Particles by an Oxidation-Reduction Process

A Novel Approach to Integrating 3D/4D Printing and Stretchable Conductive Adhesive Technologies for High Frequency Packaging Applications

A Comparative Study of a Fan Out Packaged Product: Chip First and Chip Last

Peridynamic Direct Concentration Approach by Using ANSYS

Improvement of a TSV Reveal Process Comprising Direct Si/Cu Grinding and Residual Metal Removal

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
Latest Publications