Hybrid hermetic housings for active implantable neural device

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277483 ◽

2017 ◽

Author(s):

Ming-Yuan Cheng ◽

Weiguo Chen ◽

Ruiqi Lim ◽

Ramona Damalerio

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