2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
Latest Publications

TOTAL DOCUMENTS

147

(FIVE YEARS 0)

H-INDEX

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Published By IEEE

9781538630426

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Design of NFC WISP system for wearable devices

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277482 ◽

2017 ◽

Author(s):

Xuesong Zhang ◽

Qian Wang ◽

Han Guo ◽

Yu Chen ◽

Jian Cai

Keyword(s):

Wearable Devices

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Comparison of temperature distribution in FinFETs and GAAFETs based on Dual-Phase-Lag heat transfer model

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277507 ◽

2017 ◽

Author(s):

T. Raszkowski ◽

A. Samson ◽

M. Zubert ◽

M. Janicki

Keyword(s):

Heat Transfer ◽

Temperature Distribution ◽

Heat Transfer Model ◽

Transfer Model ◽

Phase Lag ◽

Dual Phase

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Survey on 3D-ICs thermal modeling, analysis, and management techniques

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277428 ◽

2017 ◽

Author(s):

Khaled Salah

Keyword(s):

Thermal Modeling ◽

3D Ics ◽

Modeling Analysis ◽

Management Techniques

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FOWLP design for HBM applications

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277551 ◽

2017 ◽

Author(s):

Lim Teck Guan ◽

David Ho ◽

Jong Ming Chinq ◽

Surya Bhattacharya

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Thermal characterization for dual side SiP module technology

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277491 ◽

2017 ◽

Cited By ~ 2

Author(s):

Bo-Syun Chen ◽

Tang-Yuan Chen ◽

Jin-Feng Yang ◽

Chin-Li-Kao ◽

Yu-Chang Chen ◽

...

Keyword(s):

Thermal Characterization

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Indexer PVD platform — The key enabler for high productivity and low contact resistance for next-generation WLP applications

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277518 ◽

2017 ◽

Cited By ~ 1

Author(s):

Patrik Carazzetti ◽

Frantisek Balon ◽

Mike Hoffmann ◽

Juergen Weichart ◽

Andreas Erhart ◽

...

Keyword(s):

Contact Resistance ◽

Next Generation ◽

High Productivity

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Hybrid flexible smart temperature tag with NFC technology for smart packaging

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277578 ◽

2017 ◽

Cited By ~ 3

Author(s):

Xi Zhang ◽

Xuechuan Shan ◽

Jun Wei

Keyword(s):

Smart Packaging

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Solder joint fatigue analysis under combined thermal and vibration loading

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277572 ◽

2017 ◽

Cited By ~ 2

Author(s):

K. Meier ◽

M. Roellig ◽

Y. Liu ◽

K. Bock

Keyword(s):

Solder Joint ◽

Fatigue Analysis ◽

Vibration Loading ◽

Solder Joint Fatigue

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Effect of indium on deformation of binary In-Bi alloys

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277499 ◽

2017 ◽

Author(s):

Sanghun Jin ◽

Min-su Kim ◽

Shutetsu Kanayama ◽

Hiroshi Nishikawa

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The calibration of the path between SMA connecter to co-planer structure

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277522 ◽

2017 ◽

Author(s):

Chun-Ting Lai ◽

Bo-You Chen ◽

Sung-Mao Wu

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2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Design of NFC WISP system for wearable devices

Comparison of temperature distribution in FinFETs and GAAFETs based on Dual-Phase-Lag heat transfer model

Survey on 3D-ICs thermal modeling, analysis, and management techniques

FOWLP design for HBM applications

Thermal characterization for dual side SiP module technology

Indexer PVD platform — The key enabler for high productivity and low contact resistance for next-generation WLP applications

Hybrid flexible smart temperature tag with NFC technology for smart packaging

Solder joint fatigue analysis under combined thermal and vibration loading

Effect of indium on deformation of binary In-Bi alloys

The calibration of the path between SMA connecter to co-planer structure

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
Latest Publications