2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
Latest Publications

TOTAL DOCUMENTS

147

(FIVE YEARS 0)

H-INDEX

5

(FIVE YEARS 0)

Published By IEEE

9781538630426

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The calibration of the path between SMA connecter to co-planer structure

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277522 ◽

2017 ◽

Author(s):

Chun-Ting Lai ◽

Bo-You Chen ◽

Sung-Mao Wu

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Novel end-point solution for improvement in die strength and yields with plasma dicing after grind in volume production

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277524 ◽

2017 ◽

Author(s):

Richard Barnett ◽

Oliver Ansell ◽

Martin Hanicenic ◽

Janet Hopkins

Keyword(s):

End Point ◽

Point Solution ◽

Volume Production

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Hybrid hermetic housings for active implantable neural device

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277483 ◽

2017 ◽

Author(s):

Ming-Yuan Cheng ◽

Weiguo Chen ◽

Ruiqi Lim ◽

Ramona Damalerio

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Growth and fabrication of carbon-based three-dimensional heterostructure in through-silicon vias (TSVs) for 3D interconnects

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277558 ◽

2017 ◽

Author(s):

Ye Zhu ◽

Chong Wei Tan ◽

Shen Lin Chua ◽

Yu Dian Lim ◽

Beng Kang Tay ◽

...

Keyword(s):

Three Dimensional ◽

Through Silicon Vias ◽

Silicon Vias ◽

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Dielectric constant measure using near-field measurement system

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277511 ◽

2017 ◽

Author(s):

Li-Xuan Tsai ◽

Kuan-I Cheng ◽

Sung-Mao Wu

Keyword(s):

Dielectric Constant ◽

Measurement System ◽

Field Measurement ◽

Near Field Measurement

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Impact of 3D stacking on the TSV-induced stress and the CMOS characteristics

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277496 ◽

2017 ◽

Author(s):

Aki Dote ◽

Hiroko Tashiro ◽

Hideki Kitada ◽

Shinji Tadaki ◽

Shoichi Miyahara ◽

...

Keyword(s):

Induced Stress ◽

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Design and electrical analysis for adavanced fan-out package-on-package

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277500 ◽

2017 ◽

Author(s):

Po-Chih Pan ◽

Tsun-Lung Hsieh ◽

Chih-Yi Huang ◽

Ming-Fong Jhong ◽

Chen-Chao Wang

Keyword(s):

Electrical Analysis

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Hybrid micro-fluid heat sink for high power dissipation of liquid-cooled data centre

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277466 ◽

2017 ◽

Author(s):

Yong Han ◽

Gongyue Tang ◽

Boon Long Lau ◽

Xiaowu Zhang

Keyword(s):

Heat Sink ◽

Power Dissipation ◽

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The mechanism and damage of snail trails

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277581 ◽

2017 ◽

Author(s):

Zhou Shudong

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High reliability mid-temperature pb-free alloy for multi-step soldering

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277487 ◽

2017 ◽

Author(s):

Pritha Choudhury ◽

Morgana Ribas ◽

Siuli Sarkar

Keyword(s):

High Reliability ◽

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