Yield Impacting Defects and Prevention of Microbump Formation

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc47984.2019.9026698 ◽

2019 ◽

Author(s):

Qin Ren ◽

Hongyu Li ◽

Masaya Kawano

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