2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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9781728138350
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Fabrication of High Voltage Capable TSV Using Backside via Last Process and Laser Abblation of Dry Film BCB

2019 ◽  
Author(s):  
Piotr Mackowiak ◽  
Martin Wilke ◽  
Markus Wohrmann ◽  
Robert Gernhard ◽  
Kai Zoschke ◽  
...  
Keyword(s):  
High Voltage ◽  
Dry Film

Optimization of Manifold Microchannel Heat Sink inside Interposer

2019 ◽  
Author(s):  
Weihao Li ◽  
Longguang Zhu ◽  
Feng Ji ◽  
Jinling Yu ◽  
Yufeng Jin ◽  
...  
Keyword(s):  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Manifold Microchannel

High Density RDL build-up on FO-WLP using RDL-first Approach

2019 ◽  
Author(s):  
Soon Wee Ho ◽  
Hsiao Hsiang-Yao ◽  
Simon Siak Boon Lim ◽  
Chong Ser Choong ◽  
Sharon Lim Pei Siang ◽  
...  
Keyword(s):  
High Density
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