Development of FCBGA substrate with low Dk/Df material based on automotive reliability conditions

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc47984.2019.9026708 ◽

2019 ◽

Author(s):

ShinKi Lee ◽

HanSung Lee ◽

HunJung Lim ◽

InSeok Hwang ◽

WooYong Jung ◽

...

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