TCB optimization for stacking large thinned dies with 40 and 20 μm pitch microbumps

2018 7th Electronic System-Integration Technology Conference (ESTC) ◽

10.1109/estc.2018.8546425 ◽

2018 ◽

Author(s):

Carine Gerets ◽

Jaber Derakhshandeh ◽

Pieter Bex ◽

Melina Lofrano ◽

Vladimir Cherman ◽

...

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