2018 7th Electronic System-Integration Technology Conference (ESTC)
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178
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4
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Published By IEEE

9781538668146
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Fatigue Crack Growth Analysis of Interface Between Lead Frame and Molding Compound

2018 ◽  
Author(s):  
Erkan Bektas ◽  
Katrin Broermann ◽  
Sascha P. Brumm ◽  
Goran Pecanac ◽  
Sven Rzepka ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Growth Analysis ◽  
Lead Frame ◽  
Molding Compound

Heterogeneous Integration of Vertical GaN Power Transistor on Si Capacitor for DC-DC Converters

2018 ◽  
Author(s):  
Zechun Yu ◽  
Stefan Zeltner ◽  
Norman Boettcher ◽  
Gudrun Rattmann ◽  
Juergen Leib ◽  
...  
Keyword(s):  
Heterogeneous Integration ◽  
Power Transistor

Controlling BGA joint microstructures using seed crystals

2018 ◽  
Author(s):  
Z.L. Ma ◽  
S.A. Belyakov ◽  
J.W. Xian ◽  
T. Nishimura ◽  
K. Sweatman ◽  
...  
Keyword(s):  
Seed Crystals ◽  
Joint Microstructures

3D Multilayered Ceramics – harsh environment interposer technologies expand into 3rd dimension

2018 ◽  
Author(s):  
Steffen Ziesche ◽  
Christian Lenz ◽  
Axel Mueller-Koehn ◽  
Uwe Scheithauer ◽  
Uwe Partsch
Keyword(s):  
Harsh Environment

Status and review of advanced mixed-mode bending fracture test (AMB)

2018 ◽  
Author(s):  
Marcus Schulz ◽  
Jurgen Keller ◽  
Clemence Vernier ◽  
Marc Dressler ◽  
Bernhard Wunderle
Keyword(s):  
Mixed Mode ◽  
Fracture Test ◽  
Bending Fracture

Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic Loading

2018 ◽  
Author(s):  
Ali Mazloum-Nejadari ◽  
Martin Lederer ◽  
Golta Khatibi ◽  
Bernhard Czerny ◽  
Laurens Weiss ◽  
...  
Keyword(s):  
Cyclic Loading ◽  
Copper Wire ◽  
Electronic Packages ◽  
Wire Bonds
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