2018 7th Electronic System-Integration Technology Conference (ESTC)
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178
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Published By IEEE

9781538668146
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Heat Capacitive PCB

2018 ◽  
Author(s):  
Jonathan Silvano de Sousa ◽  
Sabine Liebfahrt ◽  
Bernhard Reitmaier ◽  
Maria Prutti ◽  
Bernd Schuscha ◽  
...  

TCB optimization for stacking large thinned dies with 40 and 20 μm pitch microbumps

2018 ◽  
Author(s):  
Carine Gerets ◽  
Jaber Derakhshandeh ◽  
Pieter Bex ◽  
Melina Lofrano ◽  
Vladimir Cherman ◽  
...  

scholarly journals Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates

2018 ◽  
Author(s):  
J. Hinton ◽  
M. Mirgkizoudi ◽  
A. Campos-Zatarain ◽  
D. Flynn ◽  
R.A. Harris ◽  
...  
Keyword(s):  
Thick Film

Development of a wafer level packaging technology for high voltage applications

2018 ◽  
Author(s):  
Marion Volpert ◽  
Abdenacer Aitmani ◽  
Adrien Gasse ◽  
Brigitte Soulier ◽  
Patrick Peray ◽  
...  
Keyword(s):  
High Voltage ◽  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging
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