Reliability investigation of system in package devices toward aeronautic requirements: Methodology and application

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529918 ◽

2013 ◽

Author(s):

A. Renault ◽

F. Moliere ◽

C. Munier

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