2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications

TOTAL DOCUMENTS

108

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467361392, 9781467361385, 9781467361378

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Reliability investigation of system in package devices toward aeronautic requirements: Methodology and application

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529918 ◽

2013 ◽

Author(s):

A. Renault ◽

F. Moliere ◽

C. Munier

Download Full-text

Protection Power device performance investigation using TCAD simulations

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529904 ◽

2013 ◽

Cited By ~ 1

Author(s):

F. Roqueta ◽

K. Tahri

Keyword(s):

Power Device ◽

Device Performance ◽

Tcad Simulations

Download Full-text

Multiscale FE modeling concepts applied to microelectronic device simulations

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529950 ◽

2013 ◽

Cited By ~ 4

Author(s):

H. Kock ◽

S. de Filippis ◽

M. Nelhiebel ◽

M. Glavanovics ◽

M. Kaltenbacher

Keyword(s):

Fe Modeling ◽

Microelectronic Device

Download Full-text

Molecularly derived mesoscale modeling of an epoxy/Cu interface (Part IV): The effect of Filler

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529897 ◽

2013 ◽

Author(s):

N. Iwamoto

Keyword(s):

Mesoscale Modeling

Download Full-text

FEM simulations of back contact solar modules during temperature cycling

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529964 ◽

2013 ◽

Author(s):

F. Kraemer ◽

S. Wiese

Keyword(s):

Temperature Cycling ◽

Back Contact ◽

Fem Simulations

Download Full-text

The evaluation of flowability and wire sweep by epoxy molding compound for power module packages using Moldflow™

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529940 ◽

2013 ◽

Cited By ~ 1

Author(s):

Taekkeun Lee ◽

Aimee Lim ◽

Youngsun Ko ◽

Taewoo Lee ◽

Byoungok Lee

Keyword(s):

Power Module ◽

Epoxy Molding Compound ◽

Molding Compound

Download Full-text

Analysis and simulation of cracks and micro cracks in PV cells

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529952 ◽

2013 ◽

Cited By ~ 1

Author(s):

J. Al Ahmar ◽

S. Wiese

Keyword(s):

Micro Cracks

Download Full-text

Remote phosphor deposition on LED arrays with pre-encapsulated silicone lens

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529893 ◽

2013 ◽

Cited By ~ 3

Author(s):

J. C. C. Lo ◽

H. Liu ◽

S. W. R. Lee ◽

X. Guo ◽

H. Zhao

Keyword(s):

Remote Phosphor ◽

Led Arrays

Download Full-text

Multiscale creep modeling of the effect of micro-alloying Manganese into SAC105 solder

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529963 ◽

2013 ◽

Author(s):

S. Mukherjee ◽

A. Dasgupta

Keyword(s):

Sac105 Solder

Download Full-text

Reliability assessment of a MEMS microphone under shock impact loading

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2013.6529899 ◽

2013 ◽

Cited By ~ 3

Author(s):

J. Li ◽

J. Makkonen ◽

M. Broas ◽

J. Hokka ◽

T. T. Mattila ◽

...

Keyword(s):

Impact Loading ◽

Reliability Assessment ◽

Mems Microphone ◽

Shock Impact

Download Full-text

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Reliability investigation of system in package devices toward aeronautic requirements: Methodology and application

Protection Power device performance investigation using TCAD simulations

Multiscale FE modeling concepts applied to microelectronic device simulations

Molecularly derived mesoscale modeling of an epoxy/Cu interface (Part IV): The effect of Filler

FEM simulations of back contact solar modules during temperature cycling

The evaluation of flowability and wire sweep by epoxy molding compound for power module packages using Moldflow™

Analysis and simulation of cracks and micro cracks in PV cells

Remote phosphor deposition on LED arrays with pre-encapsulated silicone lens

Multiscale creep modeling of the effect of micro-alloying Manganese into SAC105 solder

Reliability assessment of a MEMS microphone under shock impact loading

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications