Solder Crack Improvement For A Power Package During TCT And PTC By Simulation

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152707 ◽

2020 ◽

Author(s):

Haibo Fan ◽

Tim Boettcher ◽

Civen Li ◽

Eric Cheam ◽

Jun Yang ◽

...

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