2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152716 ◽

2020 ◽

Cited By ~ 1

Author(s):

Amit Pandey ◽

Stephan Kuhn ◽

Huseyin Erdogan ◽

Klaus Schneider ◽

Gordon Elger

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Element Analysis

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System Software Reliability

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152686 ◽

2020 ◽

Author(s):

Willem D. Van Driel ◽

J.W. Bikker ◽

M. Tijink

Keyword(s):

Software Reliability ◽

System Software

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DSM Reballing Ball Height Prediction Model

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152667 ◽

2020 ◽

Author(s):

Chao-Wei Liu ◽

Shang-Lin Wu ◽

Ming-Hung Chen ◽

Chang-Lin Yeh ◽

Tun-Ching Pi ◽

...

Keyword(s):

Prediction Model ◽

Height Prediction

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Mechanical characterization and modeling of different pad structures

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152799 ◽

2020 ◽

Author(s):

Michele Calabretta ◽

Daniele Guarnera ◽

Alessandro Sitta ◽

Marco Renna ◽

Antonella Sciuto ◽

...

Keyword(s):

Mechanical Characterization

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Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152697 ◽

2020 ◽

Author(s):

Mehryar Majd ◽

Peter Meszmer ◽

Alexandru Priscaru ◽

Przemyslaw Jakub Gromala ◽

Bernhard Wunderle

Keyword(s):

Neural Networks ◽

Thermal Shock ◽

Condition Monitoring ◽

Using Data

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Passive Micromixer with Sharp Edges: Simulation and Optimization

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152197 ◽

2020 ◽

Author(s):

Moein Talebian Gevari ◽

Ali Kosar ◽

Murat Kaya Yapici

Keyword(s):

Simulation And Optimization ◽

Passive Micromixer ◽

Sharp Edges

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Solder Crack Improvement For A Power Package During TCT And PTC By Simulation

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152707 ◽

2020 ◽

Author(s):

Haibo Fan ◽

Tim Boettcher ◽

Civen Li ◽

Eric Cheam ◽

Jun Yang ◽

...

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Thermal On-Board Spectroscopy: Thermal Impedance Simulation Using FEM and Thermal Modelling

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152637 ◽

2020 ◽

Author(s):

Mohamad El Khatib ◽

Sven Reitz ◽

Jens Warmuth

Keyword(s):

Thermal Modelling ◽

Thermal Impedance

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Analytical multi-step homogenization methodology for a stack of thin films in microelectronics

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152652 ◽

2020 ◽

Author(s):

H. F. Miled ◽

F. Roqueta ◽

J. C. Craveur ◽

E. Le Bourhis ◽

P. Gardes ◽

...

Keyword(s):

Thin Films

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Numerical Analysis of Impact Induced Failure for MEMS Membranes during Guided Free Fall Tests

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime48426.2020.9152647 ◽

2020 ◽

Author(s):

David Faraci ◽

Aldo Ghisi ◽

Silvia Adorno ◽

Alberto Corigliano

Keyword(s):

Numerical Analysis ◽

Free Fall

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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras

System Software Reliability

DSM Reballing Ball Height Prediction Model

Mechanical characterization and modeling of different pad structures

Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests

Passive Micromixer with Sharp Edges: Simulation and Optimization

Solder Crack Improvement For A Power Package During TCT And PTC By Simulation

Thermal On-Board Spectroscopy: Thermal Impedance Simulation Using FEM and Thermal Modelling

Analytical multi-step homogenization methodology for a stack of thin films in microelectronics

Numerical Analysis of Impact Induced Failure for MEMS Membranes during Guided Free Fall Tests

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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras

System Software Reliability

DSM Reballing Ball Height Prediction Model

Mechanical characterization and modeling of different pad structures

Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests

Passive Micromixer with Sharp Edges: Simulation and Optimization

Solder Crack Improvement For A Power Package During TCT And PTC By Simulation

Thermal On-Board Spectroscopy: Thermal Impedance Simulation Using FEM and Thermal Modelling

Analytical multi-step homogenization methodology for a stack of thin films in microelectronics

Numerical Analysis of Impact Induced Failure for MEMS Membranes during Guided Free Fall Tests

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications