Soft CMP pads for low defectivity in CMP processes

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017273 ◽

2014 ◽

Author(s):

Fengji Yeh ◽

Anson Yeh ◽

Marty W. DeGroot ◽

Bainian Qian ◽

Arun Reddy ◽

...

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