Proceedings of International Conference on Planarization/CMP Technology 2014
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9781479955572, 9781479955565

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Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017229 ◽

2014 ◽

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High-k metal gate poly opening polish at 28nm technology polish rate and selective study

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017275 ◽

2014 ◽

Author(s):

W. S. Sie ◽

Y. L. Liu ◽

J. L. Chen ◽

W. C. Hong ◽

R. P. Huang ◽

...

Keyword(s):

High K ◽

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Soft CMP pads for low defectivity in CMP processes

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017273 ◽

2014 ◽

Author(s):

Fengji Yeh ◽

Anson Yeh ◽

Marty W. DeGroot ◽

Bainian Qian ◽

Arun Reddy ◽

...

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Effects of pump-induced particle agglomeration during chemical mechanical planarization (CMP)

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017293 ◽

2014 ◽

Author(s):

Young-Gil Seo ◽

Jin-Goo Park ◽

Periyasamy Elaiyaraju

Keyword(s):

Chemical Mechanical Planarization ◽

Particle Agglomeration

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"KENMA", the origin of manufacturing, planarization CMP and its future — A breakthrough toward high-efficient machining of hard-to-machine innovative materials

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017232 ◽

2014 ◽

Author(s):

Toshiro K. Doi

Keyword(s):

High Efficient ◽

Innovative Materials

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Reducing slurry agglomeration with low shear filtration

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017302 ◽

2014 ◽

Author(s):

Yi Wei Lu ◽

Bob Shie ◽

Dean Tsou ◽

Steven Hsiao ◽

Henry Wang

Keyword(s):

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Realization of atomic-level smooth surface of sapphire (0001) by chemical-mechanical planarization with nano colloidal silica abrasives

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017292 ◽

2014 ◽

Author(s):

Xiaolei Shi ◽

Guoshun Pan ◽

Yan Zhou ◽

Yuhong Liu

Keyword(s):

Smooth Surface ◽

Colloidal Silica ◽

Chemical Mechanical Planarization ◽

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CMP of GaN using sulfate radicals generated by metal catalyst

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017290 ◽

2014 ◽

Author(s):

Zou Chunli ◽

Pan Guoshun ◽

Xu Li ◽

Shi Xiaolei ◽

Yuyu Liu

Keyword(s):

Metal Catalyst ◽

Sulfate Radicals

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Cover

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017224 ◽

2014 ◽

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Chemical mechanical properties of perovskite oxide abrasive grain: First-principles approach

Proceedings of International Conference on Planarization/CMP Technology 2014 ◽

10.1109/icpt.2014.7017280 ◽

2014 ◽

Author(s):

Nobuki Ozawa ◽

Yuji Higuchi ◽

Momoji Kubo

Keyword(s):

Mechanical Properties ◽

First Principles ◽

Perovskite Oxide ◽

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