Proceedings of International Conference on Planarization/CMP Technology 2014
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9781479955572, 9781479955565
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Soft CMP pads for low defectivity in CMP processes

2014 ◽  
Author(s):  
Fengji Yeh ◽  
Anson Yeh ◽  
Marty W. DeGroot ◽  
Bainian Qian ◽  
Arun Reddy ◽  
...  

High-k metal gate poly opening polish at 28nm technology polish rate and selective study

2014 ◽  
Author(s):  
W. S. Sie ◽  
Y. L. Liu ◽  
J. L. Chen ◽  
W. C. Hong ◽  
R. P. Huang ◽  
...  
Keyword(s):  
Metal Gate ◽  
High K ◽  
Polish Rate

Defect reduction with CMP pad dressing optimization

2014 ◽  
Author(s):  
Yi-Liang Liu ◽  
Wu-Sian Sie ◽  
Chun-Lin Chen ◽  
P.C. Huang ◽  
Yu-Ting Li ◽  
...  
Keyword(s):  
Defect Reduction
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