Moldability improvements in thin quad flat packages (TQFPs)

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559741 ◽

2002 ◽

Author(s):

S. Downey ◽

D. Hagen ◽

M.L. Lim ◽

R. Ibrahim ◽

K. Anuar ◽

...

Download Full-text