Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium
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76

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8

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0780336429

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High reliable FC-PBGA

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559696 ◽

2002 ◽

Author(s):

Y. Ishida ◽

T. Katoh ◽

S. Ishiwata ◽

A. Omura ◽

T. Oohara

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Transport mechanism in borophosphosilicate glass passivation

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559729 ◽

2002 ◽

Author(s):

A. Achari

Keyword(s):

Transport Mechanism ◽

Borophosphosilicate Glass

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A method for the measurement of chip to leadframe adhesion in LOC packages

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559772 ◽

2002 ◽

Author(s):

S.S. Ahmad ◽

Tongbi Jiang ◽

W. Moden ◽

C. Breen ◽

J. Reeder

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Prototype sensor and data acquisition system for the CILAP polymer deposition process

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559786 ◽

2002 ◽

Author(s):

A. Krauss ◽

T. Miller

Keyword(s):

Data Acquisition ◽

Data Acquisition System ◽

Deposition Process ◽

Acquisition System ◽

Polymer Deposition

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Eutectic solder flip chip technology for chip scale package

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559794 ◽

2002 ◽

Author(s):

C. Takubo ◽

N. Hirano ◽

K. Doi ◽

H. Tazawa ◽

E. Hosomi ◽

...

Keyword(s):

Flip Chip ◽

Eutectic Solder ◽

Chip Technology ◽

Chip Scale Package

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An improved method for inspection of solder joints using X-ray laminography and X-ray microtomography

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559785 ◽

2002 ◽

Author(s):

A.R. Kalukin ◽

V. Sankaran ◽

B. Chartrand ◽

D.L. Millard ◽

R.P. Kraft ◽

...

Keyword(s):

Solder Joints ◽

Improved Method ◽

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Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559678 ◽

2002 ◽

Author(s):

R. Aschenbrenner ◽

A. Ostmann ◽

G. Motulla ◽

E. Zakel ◽

H. Reichl

Keyword(s):

Flip Chip ◽

Electroless Nickel ◽

Conductive Adhesives ◽

Chip Attachment

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Flip-chip BGA assembly process and reliability improvements

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559690 ◽

2002 ◽

Author(s):

P. Thompson ◽

C. Koehler ◽

M. Petras ◽

C. Solis

Keyword(s):

Flip Chip ◽

Assembly Process

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Developing an underfill process for dense flip chip applications

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559676 ◽

2002 ◽

Author(s):

W.H. Leong

Keyword(s):

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Moldability improvements in thin quad flat packages (TQFPs)

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559741 ◽

2002 ◽

Author(s):

S. Downey ◽

D. Hagen ◽

M.L. Lim ◽

R. Ibrahim ◽

K. Anuar ◽

...

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