A method for the measurement of chip to leadframe adhesion in LOC packages

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1996.559772 ◽

2002 ◽

Author(s):

S.S. Ahmad ◽

Tongbi Jiang ◽

W. Moden ◽

C. Breen ◽

J. Reeder

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